Micromaterials LLC
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 3 name spellings.
0
Ending by 2030
Jul 2035
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Jan 18, 2027The maintenance fee for Methods for controllable metal and barrier-liner recess (US 11,705,366) comes due Jan 18, 2027. Unpaid by Jul 19, 2027, it lapses early.
- 1 fee due Jun 17, 2027The maintenance fee for Mask scheme for cut pattern flow with enlarged EPE window (US 10,510,540) comes due Jun 17, 2027. Unpaid by Dec 17, 2027, it lapses early.
- 1 fee due Jul 7, 2027The maintenance fee for High pressure wafer processing systems and related methods (US 10,529,603) comes due Jul 7, 2027. Unpaid by Jan 7, 2028, it lapses early.
- 1 fee due Sep 17, 2027The maintenance fee for Selectively etched self-aligned via processes (US 10,593,594) comes due Sep 17, 2027. Unpaid by Mar 17, 2028, it lapses early.
Recent changes
- 1 term has ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 9,962,919 | Method of separating a carrier-workpiece bonded stack In force · From the USPTO record | In force | From the USPTO record | |
| US 9,991,150 | Procedure of processing a workpiece and an apparatus designed for the procedure In force · From the USPTO record | In force | From the USPTO record | |
| US 11,097,306 | Support for bonding a workpiece and method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 10,179,941 | Gas delivery system for high pressure processing chamber In force · From the USPTO record | In force | From the USPTO record | |
| US 10,224,224 | High pressure wafer processing systems and related methods In force · From the USPTO record | In force | From the USPTO record | |
| US 10,529,603 | High pressure wafer processing systems and related methods In force · From the USPTO record | In force | From the USPTO record | |
| US 10,510,540 | Mask scheme for cut pattern flow with enlarged EPE window In force · From the USPTO record | In force | From the USPTO record | |
| US 11,049,695 | Metal contact landing structure In force · From the USPTO record | In force | From the USPTO record | |
| US 10,692,728 | Use of selective aluminum oxide etch In force · From the USPTO record | In force | From the USPTO record | |
| US 10,720,341 | Gas Delivery System for High Pressure Processing Chamber In force · High confidence | In force | High confidence |
Also on record, not counted in the 21: 14 lapsed for an unpaid fee. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
1 abandoned · 6 no status recorded