Micross Advanced Interconnect Technology LLC
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
15
Ending by 2030
Mar 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Aug 9, 2027The maintenance fee for Electronic Devices Utilizing Contact Pads with Protrusions and Methods for Fabrication (US 9,257,335) comes due Aug 9, 2027. Unpaid by Feb 9, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,198,974 | Flexible Electrostatic Actuator In force · High confidence | In force | High confidence | |
| US 8,486,765 | Structure And Process For Electrical Interconnect And Thermal Management In force · High confidence | In force | High confidence | |
| US 8,222,086 | Integrated Semiconductor Substrate Structure Using Incompatible Processes In force · High confidence | In force | High confidence | |
| US 8,008,134 | Large Substrate Structural Vias In force · High confidence | In force | High confidence | |
| US 8,404,585 | Preventing breakage of long metal signal conductors on semiconductor substrates In force · High confidence | In force | High confidence | |
| US 7,944,041 | Integrated Semiconductor Substrate Structure Using Incompatible Processes In force · High confidence | In force | High confidence | |
| US 7,709,966 | Large Substrate Structural Vias In force · High confidence | In force | High confidence | |
| US 7,999,388 | Preventing Breakage of Long Metal Signal Conductors on Semiconductor Substrates In force · High confidence | In force | High confidence | |
| US 7,829,994 | Semiconductor Substrate Elastomeric Stack In force · High confidence | In force | High confidence | |
| US 7,764,498 | Comb-Shaped Power Bus Bar Assembly Structure Having Integrated Capacitors In force · High confidence | In force | High confidence |
Also on record, not counted in the 24: 9 lapsed for an unpaid fee · 13 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
Every application published under this name has become a patent.