Multek Technologies Limited
11 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 2 name spellings.
0
Ending by 2030
Mar 2031
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 11, 2026The maintenance fee for Dummy core plus plating resist restrict resin process and structure (US 10,321,560) comes due Dec 11, 2026. Unpaid by Jun 11, 2027, it lapses early.
- 1 fee due Jun 3, 2027The maintenance fee for Circuit board with embedded metal pallet and a method of fabricating the circuit board (US 10,499,500) comes due Jun 3, 2027. Unpaid by Dec 3, 2027, it lapses early.
- 1 fee due Jul 5, 2027The maintenance fee for Method of Making an Inlay PCB with Embedded Coin (US 9,232,630) comes due Jul 5, 2027. Unpaid by Jan 5, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,302,301 | Method for Backdrilling via Stubs of Multilayer Printed Circuit Boards with Reduced Backdrill Diameters In force · High confidence | In force | High confidence | |
| US 9,232,630 | Method of Making an Inlay PCB with Embedded Coin In force · High confidence | In force | High confidence | |
| US 9,433,084 | Method for Backdrilling via Stubs of Multilayer Printed Circuit Boards with Reduced Backdrill Diameters In force · High confidence | In force | High confidence | |
| US 9,565,748 | Nano-Copper Solder for Filling Thermal Vias In force · High confidence | In force | High confidence | |
| US 10,015,880 | Rip stop on flex and rigid flex circuits In force · From the USPTO record | In force | From the USPTO record | |
| US 9,661,743 | Flexible circuit board and method of fabricating In force · From the USPTO record | In force | From the USPTO record | |
| US 9,549,463 | Rigid to flexible PC transition In force · From the USPTO record | In force | From the USPTO record | |
| US 9,763,327 | Selective segment via plating process and structure In force · From the USPTO record | In force | From the USPTO record | |
| US 9,867,290 | Selective segment via plating process and structure In force · From the USPTO record | In force | From the USPTO record | |
| US 9,992,880 | Rigid-bend printed circuit board fabrication In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 19: 11 patents in force now held by others · 10 lapsed for an unpaid fee · 6 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
3 no status recorded