Nepes Co., Ltd.
1 more in force is now held by another company
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
9
Ending by 2030
Jul 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 13, 2026The maintenance fee for Composition for Manufacturing Passivation Layer and Passivation Layer Using the Same (US 11,674,047) comes due Dec 13, 2026. Unpaid by Jun 14, 2027, it lapses early.
- 1 fee due Feb 13, 2027The maintenance fee for Semiconductor package and method of manufacturing the same (US 10,381,312) comes due Feb 13, 2027. Unpaid by Aug 13, 2027, it lapses early.
- 1 fee due Mar 10, 2027The maintenance fee for Semiconductor package and method of manufacturing the same (US 10,410,968) comes due Mar 10, 2027. Unpaid by Sep 10, 2027, it lapses early.
- 1 fee due Oct 2, 2027The maintenance fee for Semiconductor package and manufacturing method thereof (US 11,948,891) comes due Oct 2, 2027. Unpaid by Apr 3, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,977,789 | Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same In force · From the USPTO record | In force | From the USPTO record | |
| US 7,808,095 | Ultra slim semiconductor package and method of fabricating the same In force · From the USPTO record | In force | From the USPTO record | |
| US 7,919,833 | Semiconductor package having a crack-propagation preventing unit In force · From the USPTO record | In force | From the USPTO record | |
| US 7,906,842 | Wafer level system in package and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,093,721 | Flip chip semiconductor package and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 7,828,453 | Light emitting device and lamp-cover structure containing luminescent material In force · From the USPTO record | In force | From the USPTO record | |
| US 8,350,453 | Lamp cover including a phosphor mixed structure for light emitting device In force · From the USPTO record | In force | From the USPTO record | |
| US 8,237,276 | Bump structure and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,421,211 | Wafer level semiconductor package and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,759,436 | Transparent color coating composition containing nanosize dispersed pigments, coated substrate and method for preparing same In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 39: 1 patent in force now held by others · 2 lapsed for an unpaid fee · 2 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
3 pending · 11 no status recorded