NGK Electronics Devices, Inc.
1 more in force is now held by another company
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
May 2037
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 2 fees due Jun 19 to 26, 2027 · next Jun 19
- 2 fees due Aug 13, 2027
- 1 fee due Nov 7, 2027The maintenance fee for Package, and Method for Manufacturing Power Semiconductor Module (US 11,978,682) comes due Nov 7, 2027. Unpaid by May 8, 2028, it lapses early.
Recent changes
- 2 of the patents on this record were granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 10,790,245 | High-Frequency Ceramic Board and High-Frequency Semiconductor Element Package In force · High confidence | In force | High confidence | |
| US 10,937,715 | Substrate for Power Module, Collective Substrate for Power Modules, and Method for Manufacturing Substrate for Power Module In force · High confidence | In force | High confidence | |
| US 11,178,762 | Connection Structure for Wiring Substrate and Flexible Substrate and Package for Housing Electronic Components In force · High confidence | In force | High confidence | |
| US 11,897,817 | Ceramic Sintered Body and Substrate for Semiconductor Device In force · High confidence | In force | High confidence | |
| US 11,901,268 | Package with an Electrode-Attached Frame Supported by a Heat Sink, and Method for Manufacturing Power Semiconductor Module Provided Therewith In force · High confidence | In force | High confidence | |
| US 11,978,682 | Package, and Method for Manufacturing Power Semiconductor Module In force · High confidence | In force | High confidence | |
| US 12,209,313 | Metal Member and Production Method Therefor In force · High confidence | In force | High confidence | |
| US 11,849,538 | Composite Wiring Board, Package, and Electronic Device In force · High confidence | In force | High confidence | |
| US 12,615,865 | Package In force · High confidence | In force | High confidence | |
| US 11,854,934 | Package with Heat Dissipating Substrate In force · High confidence | In force | High confidence |
Also on record, not counted in the 12: 1 patent in force now held by others. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
2 pending · 3 abandoned