Semiconductor Device Having Semiconductor Layer on Insulating Structure and Method of Manufacturing the Same
A patent family: one line of work, grouped by real continuity rather than by a technology label
inferred from titles. 2 of these applications claim priority to application 11/727,971, filed Mar 29, 2007. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
| Patent | Title | Holder | Status | Expires | Time remaining | Confidence |
|---|---|---|---|---|---|---|
| US 8,080,850 | Semiconductor Device Having Semiconductor Layer on Insulating Structure and Method of Manufacturing the Same In force · Medium confidence | NEC LCD Technologies, Ltd. | In force | Medium confidence | ||
| US 8,779,512 | Method of Manufacturing a Semiconductor Device In force · High confidence | NEC LCD Technologies, Ltd. | In force | High confidence | ||
| US 7,772,645 | Semiconductor Device Having Semiconductor Layer on Insulating Structure and Method of Manufacturing the Same In force · High confidence | NLT Technologies, Ltd. | In force | High confidence | ||
| US 8,431,447 | Method of Manufacturing a Semiconductor Device with a Front-End Insulating Layer Interposed Between a Semiconductor Layer and an Insulating Substrate Lapsed Apr 30, 2025 on the fee record Ended Apr 30, 2025 · High confidence | NEC LCD Technologies, Ltd. | Lapsed Apr 30, 2025 on the fee record | Ended Apr 30, 2025 | Ended Apr 30, 2025 | High confidence |
4 of 4 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
3 of these are in force and held by NLT Technologies, Ltd..
Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.