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PatentTitleStatus Expires Confidence
US 7,663,523System Unit Element Selection
Formerly held
In force
 · High confidence
In forceHigh confidence
US 8,778,806Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Formerly held
In force
 · High confidence
In forceHigh confidence
US 8,785,332Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Formerly held
In force
 · High confidence
In forceHigh confidence
US 8,796,154Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Formerly held
In force
 · High confidence
In forceHigh confidence
US 8,802,545Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Formerly held
In force
 · High confidence
In forceHigh confidence
US 8,980,764Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Formerly held
In force
 · High confidence
In forceHigh confidence
US 9,070,760Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Formerly held
In force
 · High confidence
In forceHigh confidence
US 9,082,839Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
Formerly held
In force
 · High confidence
In forceHigh confidence
US 9,105,705Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Formerly held
In force
 · High confidence
In forceHigh confidence
US 9,202,720Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
Formerly held
In force
 · High confidence
In forceHigh confidence
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