Ormet Circuits, Inc.
1 more in force is now held by another company
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
1
Ending by 2030
Mar 2030
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
No maintenance fee falls due on this company's record before Nov 14, 2027.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,221,518 | Conductive Compositions Containing Blended Alloy Fillers In force · High confidence | In force | High confidence | |
| US 9,003,648 | Methods to Produce High Density, Multilayer Printed Wiring Boards from Parallel-Fabricated Circuits and Filled Vias In force · High confidence | In force | High confidence | |
| US 8,840,700 | Preparation of metallurgic network compositions and methods of use thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 9,005,330 | Electrically Conductive Compositions Comprising Non-Eutectic Solder Alloys In force · High confidence | In force | High confidence | |
| US 9,583,453 | Semiconductor Packaging Containing Sintering Die-Attach Material In force · High confidence | In force | High confidence | |
| US 12,053,934 | Conductive Film Adhesive In force · Medium confidence | In force | Medium confidence | |
| US 11,440,142 | Alternative compositions for high temperature soldering applications In force · From the USPTO record | In force | From the USPTO record | |
| US 10,727,193 | Sintering Pastes with High Metal Loading for Semiconductor Die Attach Applications In force · Medium confidence | In force | Medium confidence | |
| US 11,217,554 | Metallic Adhesive Compositions Having Good Work Lives and Thermal Conductivity, Methods of Making Same and Uses Thereof In force · High confidence | In force | High confidence | |
| US 12,388,004 | Lithographically Defined Electrical Interconnects from Conductive Pastes In force · High confidence | In force | High confidence |
Also on record, not counted in the 11: 1 patent in force now held by others · 1 lapsed for an unpaid fee · 12 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
1 pending · 2 no status recorded