Pac Tech - Packaging Technologies GmbH
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 5 name spellings.
12
Ending by 2030
Aug 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Jan 16, 2027The maintenance fee for Method for producing a chip module (US 10,354,971) comes due Jan 16, 2027. Unpaid by Jul 16, 2027, it lapses early.
- 1 fee due Oct 28, 2027The maintenance fee for Device for removing a test contact of a test contact arrangement (US 10,634,699) comes due Oct 28, 2027. Unpaid by Apr 28, 2028, it lapses early.
- 1 fee due Nov 3, 2027The maintenance fee for Method and device for contacting, positioning and impinging a solder ball formation with laser energy (US 9,327,360) comes due Nov 3, 2027. Unpaid by May 3, 2028, it lapses early.
Recent changes
- 1 of the patents on this record was granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,882,997 | Method and device for mutual contacting of two wafers In force · From the USPTO record | In force | From the USPTO record | |
| US 8,256,131 | Method and device for drying circuit substrates In force · From the USPTO record | In force | From the USPTO record | |
| US 7,717,316 | Method and device for applying a solder to a substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 8,328,068 | Transfer device for receiving and transferring a solder ball arrangement In force · From the USPTO record | In force | From the USPTO record | |
| US 8,087,163 | Method of manufacturing a contact arrangement between a microelectronic component and a carrier In force · From the USPTO record | In force | From the USPTO record | |
| US 8,497,578 | Terminal face contact structure and method of making same In force · From the USPTO record | In force | From the USPTO record | |
| US 8,330,076 | Method and device for removing solder material deposits from a substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 8,205,325 | Device for applying an electronic component In force · From the USPTO record | In force | From the USPTO record | |
| US 8,480,298 | Device for positioning and contacting test contacts In force · From the USPTO record | In force | From the USPTO record | |
| US 9,401,298 | Method and device for transferring a chip to a contact substrate In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 40: 7 lapsed for an unpaid fee · 37 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
6 pending · 8 no status recorded