Princo Corp.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
10
Ending by 2030
Jun 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 2 fees due Feb 11 to 27, 2027 · next Feb 11
- 1 fee due Apr 22, 2027The maintenance fee for Probe card device (US 10,451,654) comes due Apr 22, 2027. Unpaid by Oct 22, 2027, it lapses early.
- 1 fee due May 10, 2027The maintenance fee for Testing device and testing method thereof (US 9,182,443) comes due May 10, 2027. Unpaid by Nov 10, 2027, it lapses early.
- 1 fee due Oct 14, 2027The maintenance fee for Substrate separation system and method (US 10,622,332) comes due Oct 14, 2027. Unpaid by Apr 14, 2028, it lapses early.
Recent changes
- 3 terms have ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,545,042 | Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure In force · From the USPTO record | In force | From the USPTO record | |
| US 7,948,079 | Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,014,164 | Hybrid structure of multi-layer substrates and manufacture method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 7,687,312 | Method of manufacturing hybrid structure of multi-layer substrates In force · From the USPTO record | In force | From the USPTO record | |
| US 7,931,973 | Manufacturing method of metal structure in multi-layer substrate and structure thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,266,797 | Method of manufacturing a multi-layer substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 7,656,679 | Multi-layer substrate and manufacture method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,815,333 | Manufacturing method of metal structure in multi-layer substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 8,023,282 | Hybrid structure of multi-layer substrates and manufacture method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 9,107,315 | Via structure in multi-layer substrate In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 36: 13 lapsed for an unpaid fee · 1 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
2 pending · 31 no status recorded