Pulseforge, Inc.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
5
Ending by 2030
Jul 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 27, 2026The maintenance fee for Method and apparatus for removing particles from the surface of a semiconductor wafer (US 11,688,600) comes due Dec 27, 2026. Unpaid by Jun 28, 2027, it lapses early.
- 1 fee due Feb 4, 2027The maintenance fee for Method and apparatus for curing thin films on low-temperature substrates at high speeds (US 9,095,874) comes due Feb 4, 2027. Unpaid by Aug 4, 2027, it lapses early.
- 2 fees due Mar 24 to 26, 2027 · next Mar 24
- 1 fee due Jul 12, 2027The maintenance fee for Method for forming and stabilizing printed conductors on a flexible substrate (US 9,237,637) comes due Jul 12, 2027. Unpaid by Jan 12, 2028, it lapses early.
- 1 fee due Aug 4, 2027The maintenance fee for Method for providing lateral thermal processing of thin films on low-temperature substrates (US 10,553,450) comes due Aug 4, 2027. Unpaid by Feb 4, 2028, it lapses early.
Recent changes
- 1 term has ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,945,686 | Method for reducing thin films on low temperature substrates In force · From the USPTO record | In force | From the USPTO record | |
| US 7,820,097 | Electrical, plating and catalytic uses of metal nanomaterial compositions In force · From the USPTO record | In force | From the USPTO record | |
| US 8,674,618 | Method and apparatus for curing thin films on low-temperature substrates at high speeds In force · From the USPTO record | In force | From the USPTO record | |
| US 9,095,874 | Method and apparatus for curing thin films on low-temperature substrates at high speeds In force · From the USPTO record | In force | From the USPTO record | |
| US 9,643,208 | Method and apparatus for curing thin films on low-temperature substrates at high speeds In force · From the USPTO record | In force | From the USPTO record | |
| US 9,237,637 | Method for forming and stabilizing printed conductors on a flexible substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 9,006,047 | Method for Providing Lateral Thermal Processing of Thin Films on Low-Temperature Substrates In force · Medium confidence | In force | Medium confidence | |
| US 10,422,578 | Apparatus for curing thin films on a moving substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 8,557,642 | Method for providing lateral thermal processing of thin films on low-temperature substrates In force · From the USPTO record | In force | From the USPTO record | |
| US 8,410,712 | Method and apparatus for curing thin films on low-temperature substrates at high speeds In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 35: 4 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
4 pending · 1 abandoned · 2 no status recorded