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Raytech Systems LLC

Also on record
Records under this name other than patents Raytech Systems LLC holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.

Showing 1 to 9 of 9 · Back to Raytech Systems LLC

PatentTitleStatus Expires Confidence
US 7,037,184Polishing Pad for Use in Chemical-Mechanical Planarization of Semiconductor Wafers and Method of Making Same
Formerly held
Lapsed on the fee record
Ended May 2, 2014 · High confidence
Lapsed on the fee recordEnded May 2, 2014High confidence
US 7,025,668Gradient Polishing Pad Made from Paper-Making Fibers for Use in Chemical/Mechanical Planarization of Wafers
Formerly held
Lapsed on the fee record
Ended Apr 11, 2014 · High confidence
Lapsed on the fee recordEnded Apr 11, 2014High confidence
US 6,979,256Retaining Ring with Wear Pad for Use in Chemical Mechanical Planarization
Formerly held
Lapsed on the fee record
Ended Dec 27, 2013 · Medium confidence
Lapsed on the fee recordEnded Dec 27, 2013Medium confidence
US 6,964,601Method for Securing a Polishing Pad to a Platen for Use in Chemical-Mechanical Polishing of Wafers
Formerly held
Lapsed on the fee record
Ended Nov 15, 2013 · High confidence
Lapsed on the fee recordEnded Nov 15, 2013High confidence
US 6,945,846Polishing Pad for Use in Chemical/Mechanical Planarization of Semiconductor Wafers Having a Transparent Window for End-Point Determination and Method of Making
Formerly held
Lapsed on the fee record
Ended Sep 20, 2013 · High confidence
Lapsed on the fee recordEnded Sep 20, 2013High confidence
US 6,899,610Retaining Ring with Wear Pad for Use in Chemical Mechanical Planarization
Formerly held
Lapsed on the fee record
Ended May 31, 2013 · High confidence
Lapsed on the fee recordEnded May 31, 2013High confidence
US 6,875,077Polishing Pad for Use in Chemical/Mechanical Planarization of Semiconductor Wafers Having a Transparent Window for End-Point Determination and Method of Making
Formerly held
Lapsed on the fee record
Ended Apr 5, 2013 · High confidence
Lapsed on the fee recordEnded Apr 5, 2013High confidence
US 6,863,774Polishing Pad for Use in Chemical - Mechanical Palanarization of Semiconductor Wafers and Method of Making Same
Lapsed on the fee record
Ended Mar 8, 2013 · High confidence
Lapsed on the fee recordEnded Mar 8, 2013High confidence
US 6,852,020Polishing Pad for Use in Chemical - Mechanical Planarization of Semiconductor Wafers and Method of Making Same
Formerly held
Lapsed on the fee record
Ended Feb 8, 2013 · High confidence
Lapsed on the fee recordEnded Feb 8, 2013High confidence
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