Rofin-Sinar Technologies Inc.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
Jul 2032
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 4 fees due Feb 11 to 27, 2027 · next Feb 11
- 1 fee due Mar 3, 2027The maintenance fee for Method of material processing by laser filamentation (US 10,399,184) comes due Mar 3, 2027. Unpaid by Sep 3, 2027, it lapses early.
- 1 fee due Sep 29, 2027The maintenance fee for Method of Material Processing by Laser Filamentation (US 9,296,066) comes due Sep 29, 2027. Unpaid by Mar 29, 2028, it lapses early.
Recent changes
- 2 of the patents on this record were granted since Aug 17, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 10,399,184 | Method of material processing by laser filamentation In force · From the USPTO record | In force | From the USPTO record | |
| US 9,296,066 | Method of Material Processing by Laser Filamentation In force · High confidence | In force | High confidence | |
| US 9,102,011 | Method and Apparatus for Non-Ablative, Photoacoustic Compression Machining in Transparent Materials Using Filamentation by Burst Ultrafast Laser Pulses In force · High confidence | In force | High confidence | |
| US 9,102,007 | Method and Apparatus for Performing Laser Filamentation Within Transparent Materials In force · High confidence | In force | High confidence | |
| US 10,017,410 | Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses In force · From the USPTO record | In force | From the USPTO record | |
| US 9,517,929 | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses In force · From the USPTO record | In force | From the USPTO record | |
| US 10,010,971 | Method and apparatus for performing laser curved filamentation within transparent materials In force · From the USPTO record | In force | From the USPTO record | |
| US 10,252,507 | Method and Apparatus for Forward Deposition of Material onto a Substrate Using Burst Ultrafast Laser Pulse Energy In force · High confidence | In force | High confidence | |
| US 9,757,815 | Method and apparatus for performing laser curved filamentation within transparent materials In force · From the USPTO record | In force | From the USPTO record | |
| US 10,376,986 | Method and Apparatus for Machining Transparent Materials Using Filamentation by Burst Ultrafast Laser Pulses In force · High confidence | In force | High confidence |
Also on record, not counted in the 17: 1 lapsed for an unpaid fee. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
1 pending · 6 no status recorded