Siltectra GmbH

47 patents currently held · Updated Nov 14, 2026

Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.

Recorded under 2 name spellings.

Ending by 2030

Feb 2030

Next term end

When these terms end

5 yrs10 yrs20 yrs

Held patents by the year their term ends

20262027202820292030203120322033203420352036203720382039204020412042204320442045

Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.

2 fees due Nov 28 to 30, 2026 · next Nov 28
1 fee due Dec 4, 2026
The maintenance fee for Combined wafer production method with laser treatment and temperature-induced stresses (US 10,312,135) comes due Dec 4, 2026. Unpaid by Jun 4, 2027, it lapses early.
1 fee due Jan 11, 2027
The maintenance fee for Method for Producing a Layer of Solid Material (US 11,699,616) comes due Jan 11, 2027. Unpaid by Jul 12, 2027, it lapses early.
3 fees due Apr 3 to 17, 2027 · next Apr 3
1 fee due May 21, 2027
The maintenance fee for Laser conditioning of solid bodies using prior knowledge from previous machining steps (US 11,822,307) comes due May 21, 2027. Unpaid by Nov 22, 2027, it lapses early.
1 fee due Jun 5, 2027
The maintenance fee for Splitting of a Solid Using Conversion of Material (US 11,833,617) comes due Jun 5, 2027. Unpaid by Dec 6, 2027, it lapses early.
1 fee due Jul 9, 2027
The maintenance fee for Method for reducing the thickness of solid-state layers provided with components (US 11,869,810) comes due Jul 9, 2027. Unpaid by Jan 10, 2028, it lapses early.
2 fees due Sep 3 to 17, 2027 · next Sep 3

Which patents, and when each one lapses · Pro

Recent changes

1 of the patents on this record was granted since Aug 16, 2026
1 term has ended since Aug 16, 2026

Patents held now

Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.

Patent	Title	Status	Expires	Confidence
US 8,877,077	Method for producing thin, free-standing layers of solid state materials with structured surfaces In force Term ends Feb 24, 2030 · From the USPTO record	In force	Term ends Feb 24, 2030	From the USPTO record
US 9,754,810	Method for the production of a wafer with a carrier unit In force Term ends May 5, 2034 · From the USPTO record	In force	Term ends May 5, 2034	From the USPTO record
US 10,269,643	Method And Device For The Production Of Wafers With A Pre-Defined Break Initiation Point In force Term ends May 5, 2034 · High confidence	In force	Term ends May 5, 2034	High confidence
US 10,304,738	Method and device for the production of wafers with a pre-defined break initiation point In force Term ends May 5, 2034 · From the USPTO record	In force	Term ends May 5, 2034	From the USPTO record
US 10,580,699	Method and device for the production of wafers with a pre-defined break initiation point In force Ends no later than May 5, 2034 · From the USPTO record	In force	Ends no later than May 5, 2034	From the USPTO record
US 10,825,732	Method of producing stresses in a semiconductor wafer In force Ends no later than May 5, 2034 · From the USPTO record	In force	Ends no later than May 5, 2034	From the USPTO record
US 10,141,219	Combined production method for separating a number of thin layers of solid material from a thick solid body In force Term ends Oct 8, 2034 · From the USPTO record	In force	Term ends Oct 8, 2034	From the USPTO record
US 10,312,135	Combined wafer production method with laser treatment and temperature-induced stresses In force Term ends Oct 8, 2034 · High confidence	In force	Term ends Oct 8, 2034	High confidence
US 10,593,590	Combined wafer production method with laser treatment and temperature-induced stresses In force Term ends Oct 8, 2034 · High confidence	In force	Term ends Oct 8, 2034	High confidence
US 11,004,723	Wafer Production Method In force Term ends Oct 8, 2034 · High confidence	In force	Term ends Oct 8, 2034	High confidence

10 of 47 patents shown.

Pro members see all 47.

Pro members: see all 47 patents

Also on record, not counted in the 47: 1 lapsed for an unpaid fee · 1 surrendered on reissue. List them

Sources and methods

Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand. How this record was built

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.

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Published applications

US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.

1 pending · 1 abandoned · 5 no status recorded

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