Siltronic AG
4 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 3 name spellings.
43
Ending by 2030
Nov 2026
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 9, 2026The maintenance fee for Silicon single crystal production method (US 9,051,661) comes due Dec 9, 2026. Unpaid by Jun 9, 2027, it lapses early.
- 2 fees due Jan 7, 2027
- 1 fee due Feb 8, 2027The maintenance fee for Method for simultaneously cutting a plurality of disks from a workpiece (US 11,717,930) comes due Feb 8, 2027. Unpaid by Aug 9, 2027, it lapses early.
- 1 fee due Mar 29, 2027The maintenance fee for Semiconductor wafer with a layer of AlzGa1-zN and process for producing it (US 9,147,726) comes due Mar 29, 2027. Unpaid by Sep 29, 2027, it lapses early.
- 1 fee due Apr 17, 2027The maintenance fee for Method for producing a single crystal from semiconductor material by the FZ method; device for carrying out the method and semiconductor silicon wafer (US 11,788,201) comes due Apr 17, 2027. Unpaid by Oct 18, 2027, it lapses early.
- 2 fees due May 3 to 19, 2027 · next May 3
- 2 fees due Jun 1 to 29, 2027 · next Jun 1
- 5 fees due Jul 5 to 23, 2027 · next Jul 5
- 2 fees due Aug 2 to 20, 2027 · next Aug 2
- 2 fees due Sep 24 to 29, 2027 · next Sep 24
- 3 fees due Oct 5 to 30, 2027 · next Oct 5
- 1 fee due Nov 10, 2027The maintenance fee for Method for simultaneously cutting a multiplicity of wafers from a workpiece (US 9,333,673) comes due Nov 10, 2027. Unpaid by May 10, 2028, it lapses early.
Recent changes
- 4 of the patents on this record were granted since Aug 16, 2026
- 3 terms have ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,820,549 | Layered semiconductor wafer with low warp and bow, and process for producing it In force · From the USPTO record | In force | From the USPTO record | |
| US 7,541,287 | Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method In force · From the USPTO record | In force | From the USPTO record | |
| US 7,579,261 | Epitaxially coated silicon wafer and method for producing epitaxially coated silicon wafers In force · From the USPTO record | In force | From the USPTO record | |
| US 7,659,207 | Epitaxially coated silicon wafer and method for producing epitaxially coated silicon wafer In force · From the USPTO record | In force | From the USPTO record | |
| US 8,216,361 | Monocrystalline semiconductor wafer comprising defect-reduced regions and method for producing it In force · From the USPTO record | In force | From the USPTO record | |
| US 7,470,323 | Process for producing p-doped and epitaxially coated semiconductor wafers from silicon In force · From the USPTO record | In force | From the USPTO record | |
| US 7,828,897 | Crystal pulling apparatus and method for the production of heavy crystals In force · From the USPTO record | In force | From the USPTO record | |
| US 8,231,725 | Semiconductor wafers of silicon and method for their production In force · From the USPTO record | In force | From the USPTO record | |
| US 7,785,706 | Semiconductor wafer and process for its production In force · From the USPTO record | In force | From the USPTO record | |
| US 7,666,064 | Method for grinding semiconductor wafers In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 200: 4 patents in force now held by others · 97 lapsed for an unpaid fee · 89 ended at full term · 2 surrendered on reissue. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
19 pending · 1 abandoned · 63 no status recorded