109 patents currently held
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
1 more record may belong here and awaits a decision; it is not counted.
The next term ends in Oct 2030. from the record
Free plan: 3 watched companies. Pro: unlimited.
Alerts on its grants, lapses and transfers.
10
Ending by 2030
Oct 2030
Next term end
44
Patent families
When these terms end
Held patents by the year their term ends
notable patents
fee due within 90 days
all others
Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Notable: the highest-ranked patents in this portfolio by citations and family size. Fee due within 90 days: a maintenance fee is due within 90 days of when this page was computed and not yet paid.
Notable patents
Ranked by citations and family size, against patents of the same kind granted the same year. How we rank
Notable
Ends Jan 2031 · High confidence
Also notable
Ends Feb 2037 · Low confidence
Also notable
Ends May 2031 · High confidence
Method and System for Hybrid Integration of an Opto-Electronic Integrated Circuit
US 8,368,995
Cited by 160 later US patents, top 5% of utility patents granted in 2013 in our data, and renewed at 3 of 3 maintenance windows. Protection runs to 2031.
Broadband Back Mirror for a Photonic Chip
US 11,585,977
Cited by 15 later US patents, top 5% of utility patents granted in 2023 in our data. Protection runs to 2037. A terminal disclaimer caps this term to an earlier patent's.
Method and System for Template Assisted Wafer Bonding
US 8,222,084
Cited by 139 later US patents, top 5% of utility patents granted in 2012 in our data, and renewed at 3 of 3 maintenance windows. Protection runs to 2031.
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 4 fees due Dec 4 to 25, 2026 · next Dec 4
- 2 fees due Jan 9 to 28, 2027 · next Jan 9
- 3 fees due Feb 4 to 25, 2027 · next Feb 4
- 4 fees due Apr 6 to 27, 2027 · next Apr 6
- 2 fees due May 10 to 17, 2027 · next May 10
- 2 fees due Jun 8 to 17, 2027 · next Jun 8
- 1 fee due Jul 12, 2027The maintenance fee for Method and System for Performing Testing of Photonic Devices (US 9,236,958) comes due Jul 12, 2027. Unpaid by Jan 12, 2028, it lapses early.
- 4 fees due Aug 2 to 23, 2027 · next Aug 2
- 3 fees due Sep 10 to 29, 2027 · next Sep 10
- 3 fees due Oct 19 to 26, 2027 · next Oct 19
- 2 fees due Nov 10 to 12, 2027 · next Nov 10
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
What they patent
The 5 largest of its 44 families, grouped by real patent family and labeled by the earliest filing in each. No technology classification is inferred from titles.
| Method and System for Hybrid Integration of a Tunable Laser | 10 in force | to Nov 2034 |
| Method and System for Template Assisted Wafer Bonding | 9 in force | to Apr 2033 |
| Waveguide Mode Expander Using Amorphous Silicon | 7 in force | to May 2035 |
| Systems and Methods for Photonic Polarization Rotators | 6 in force | to Oct 2037 |
| Method and System of Heterogeneous Substrate Bonding for Photonic Integration | 6 in force | to Dec 2030 |
Patents held now
Soonest term end first.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,615,025 | Method and System for Hybrid Integration of a Tunable Laser In force · Medium confidence | In force | Medium confidence | |
| US 9,190,400 | Method and System for Heterogeneous Substrate Bonding for Photonic Integration In force · High confidence | In force | High confidence | |
| US 9,318,868 | Tunable Hybrid Laser with Carrier-Induced Phase Control In force · High confidence | In force | High confidence | |
| US 9,709,735 | Method and System for Heterogeneous Substrate Bonding for Photonic Integration In force · High confidence | In force | High confidence | |
| US 11,181,688 | Integration of an Unprocessed, Direct-Bandgap Chip into a Silicon Photonic Device In force · High confidence | In force | High confidence | |
| US 11,482,513 | Heterogeneous Substrate Bonding for Photonic Integration In force · High confidence | In force | High confidence | |
| US 12,287,510 | Integration of an Unprocessed, Direct-Bandgap Chip into a Silicon Photonic Device In force · High confidence | In force | High confidence | |
| US 12,444,723 | Heterogeneous Bonding for Photonic Integration In force · High confidence | In force | High confidence | |
| US 10,373,939 | Method and System for Heterogeneous Substrate Bonding for Photonic Integration In force · High confidence | In force | High confidence | |
| US 8,630,326 | Method and System of Heterogeneous Substrate Bonding for Photonic Integration In force · High confidence | In force | High confidence |
Also on record, not counted in the 109: 9 patents ended · 3 applications pending · 6 applications abandoned. List them
Sources and methods
Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built
Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.
Fee due within 90 days marks a patent with a maintenance fee due within 90 days of the date this page was computed and not yet recorded paid, so it can end earlier than the bar shows. A fee left unpaid ends the patent at the close of the six month grace period that follows its due date, not on the due date itself. It is not a prediction that the fee will be missed.
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.