SPP Technologies Co., Ltd.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
5
Ending by 2030
Dec 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Feb 25, 2027The maintenance fee for Apparatus, method and program for manufacturing nitride film (US 9,117,660) comes due Feb 25, 2027. Unpaid by Aug 25, 2027, it lapses early.
- 1 fee due Mar 1, 2027The maintenance fee for Plasma etching method (US 9,123,542) comes due Mar 1, 2027. Unpaid by Sep 1, 2027, it lapses early.
- 1 fee due Apr 10, 2027The maintenance fee for Maintenance support system, maintenance support method, and program (US 11,785,184) comes due Apr 10, 2027. Unpaid by Oct 12, 2027, it lapses early.
- 1 fee due Aug 11, 2027The maintenance fee for Method for producing silicon nitride film and silicon nitride film (US 10,559,459) comes due Aug 11, 2027. Unpaid by Feb 11, 2028, it lapses early.
Recent changes
- 1 of the patents on this record was granted since Aug 16, 2026
- 1 term has ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,754,613 | Etching Method and Etching Apparatus In force · High confidence | In force | High confidence | |
| US 8,546,265 | Method, Apparatus and Program for Manufacturing Silicon Structure In force · High confidence | In force | High confidence | |
| US 8,518,283 | Plasma Etching Method Capable of Detecting End Point and Plasma Etching Device Therefor In force · High confidence | In force | High confidence | |
| US 8,598,049 | Deposition method In force · From the USPTO record | In force | From the USPTO record | |
| US 8,673,781 | Plasma Etching Method In force · High confidence | In force | High confidence | |
| US 8,859,434 | Etching method In force · From the USPTO record | In force | From the USPTO record | |
| US 9,117,660 | Apparatus, method and program for manufacturing nitride film In force · From the USPTO record | In force | From the USPTO record | |
| US 9,123,542 | Plasma etching method In force · From the USPTO record | In force | From the USPTO record | |
| US 10,204,768 | Etching Device, Plasma Processing Device In force · High confidence | In force | High confidence | |
| US 10,280,084 | Silicon nitride film and method of making thereof In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 16: 5 lapsed for an unpaid fee · 7 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
2 pending · 1 abandoned · 7 no status recorded