ST Assembly Test Services Ltd.
Records under this name other than patents ST Assembly Test Services Ltd. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
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| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,700,404 | Large Die Package Structures and Fabrication Method Therefor Formerly held Term ended Term ended Mar 26, 2026 · High confidence | Term ended | Term ended Mar 26, 2026 | High confidence |
| US 7,298,026 | Large Die Package and Method for the Fabrication Thereof Formerly held Term ended Term ended Dec 28, 2025 · High confidence | Term ended | Term ended Dec 28, 2025 | High confidence |
| US 7,575,956 | Fabrication Method for Semiconductor Package Heat Spreaders Formerly held Term ended Term ended Dec 23, 2025 · High confidence | Term ended | Term ended Dec 23, 2025 | High confidence |
| US 7,381,593 | Method and Apparatus for Stacked Die Packaging Formerly held Term ended Term ended Oct 1, 2025 · High confidence | Term ended | Term ended Oct 1, 2025 | High confidence |
| US 7,863,730 | Array-Molded Package Heat Spreader and Fabrication Method Therefor Formerly held Term ended Term ended Sep 18, 2025 · High confidence | Term ended | Term ended Sep 18, 2025 | High confidence |
| US 7,327,025 | Heat Spreader for Thermally Enhanced Semiconductor Package Formerly held Term ended Term ended Aug 16, 2025 · High confidence | Term ended | Term ended Aug 16, 2025 | High confidence |
| US 7,443,039 | System for Different Bond Pads in an Integrated Circuit Package Formerly held Term ended Term ended Jun 5, 2025 · High confidence | Term ended | Term ended Jun 5, 2025 | High confidence |
| US 7,169,641 | Semiconductor Package with Selective Underfill and Fabrication Method Therfor Formerly held Term ended Term ended May 3, 2025 · High confidence | Term ended | Term ended May 3, 2025 | High confidence |
| US 7,626,277 | Integrated Circuit Package with Open Substrate Formerly held Term ended Term ended Mar 7, 2025 · High confidence | Term ended | Term ended Mar 7, 2025 | High confidence |
| US 7,306,133 | System for Fabricating an Integrated Circuit Package on a Printed Circuit Board Formerly held Term ended Term ended Nov 24, 2024 · High confidence | Term ended | Term ended Nov 24, 2024 | High confidence |