Stats ChipPAC, Inc.
1,347 more in force are now held by other companies
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 5 name spellings.
17
Ending by 2030
Nov 2026
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Mar 1, 2027The maintenance fee for Filp Chip Interconnection Structure with Bump on Partial Pad and Method Thereof (US 9,125,332) comes due Mar 1, 2027. Unpaid by Sep 1, 2027, it lapses early.
- 1 fee due May 10, 2027The maintenance fee for Semiconductor Device Having Embedded Integrated Passive Devices Electrically Interconnected Using Conductive Pillars (US 9,184,103) comes due May 10, 2027. Unpaid by Nov 10, 2027, it lapses early.
Recent changes
- 41 terms have ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,115,301 | Methods for Manufacturing Thermally Enhanced Flip-Chip Ball Grid Arrays In force · High confidence | In force | High confidence | |
| US 7,608,921 | Multi-Layer Semiconductor Package In force · High confidence | In force | High confidence | |
| US 7,994,626 | Multi-Layer Semiconductor Package with Vertical Connectors and Method of Manufacture Thereof In force · High confidence | In force | High confidence | |
| US 7,650,688 | Bonding Tool for Mounting Semiconductor Chips In force · High confidence | In force | High confidence | |
| US 7,550,828 | Leadframe Package for MEMS Microphone Assembly In force · High confidence | In force | High confidence | |
| US 7,612,444 | Semiconductor Package with Flow Controller In force · High confidence | In force | High confidence | |
| US 8,129,231 | Method of Manufacture for Semiconductor Package with Flow Controller In force · High confidence | In force | High confidence | |
| US 7,713,782 | Fusible I/O Interconnection Systems and Methods for Flip-Chip Packaging Involving Substrate-Mounted Stud-Bumps In force · High confidence | In force | High confidence | |
| US 7,622,811 | Semiconductor Assembly with Component Attached on Die Back Side In force · High confidence | In force | High confidence | |
| US 8,021,931 | Direct via Wire Bonding and Method of Assembling the Same In force · High confidence | In force | High confidence |
Also on record, not counted in the 28: 1,347 patents in force now held by others · 18 lapsed for an unpaid fee · 366 ended at full term · 14 surrendered on reissue. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
65 abandoned