Maintenance fees coming due

Stats ChipPAC, Ltd.

40 maintenance fees come due in the 12 months from Nov 14, 2026, the next on Nov 21, 2026. Unpaid by May 21, 2027, that one lapses early.

A maintenance fee does not end a patent on its due date. It falls due at 3.5, 7.5 and 11.5 years from grant, and the patent lapses only if the fee is still unpaid at the end of the six month grace period that follows.

Patent	Title	Holder	Status	Fee due	Lapses if unpaid	Expires	Confidence
US 10,297,518	Semiconductor Device and Method of Forming Supporting Layer Over Semiconductor Die in Thin Fan-Out Wafer Level Chip Scale Package Stats ChipPAC Pte. Ltd. In force Fee due Nov 21, 2026 Lapses if unpaid May 21, 2027 Term ends Sep 28, 2032 · High confidence	Stats ChipPAC Pte. Ltd.	In force	Nov 21, 2026	May 21, 2027	Term ends Sep 28, 2032	High confidence
US 10,297,519	Semiconductor Device and Method of Forming PoP Semiconductor Device with RDL Over Top Package STATS ChipPAC Pte. Ltd. In force Fee due Nov 21, 2026 Lapses if unpaid May 21, 2027 Term ends Mar 17, 2035 · High confidence	STATS ChipPAC Pte. Ltd.	In force	Nov 21, 2026	May 21, 2027	Term ends Mar 17, 2035	High confidence
US 10,297,556	Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer STATS ChipPAC Pte. Ltd. In force Fee due Nov 21, 2026 Lapses if unpaid May 21, 2027 Term ends Sep 25, 2033 · High confidence	STATS ChipPAC Pte. Ltd.	In force	Nov 21, 2026	May 21, 2027	Term ends Sep 25, 2033	High confidence
US 10,304,817	Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over a Temporary Substrate STATS ChipPAC Pte. Ltd. In force Fee due Nov 28, 2026 Lapses if unpaid May 28, 2027 Term ends Mar 15, 2033 · High confidence	STATS ChipPAC Pte. Ltd.	In force	Nov 28, 2026	May 28, 2027	Term ends Mar 15, 2033	High confidence
US 9,048,197	Integrated Circuit Package System Employing Wafer Level Chip Scale Packaging Stats ChipPAC Pte. Ltd. In force Fee due Dec 2, 2026 Lapses if unpaid Jun 2, 2027 Term ends Jul 24, 2028 · High confidence	Stats ChipPAC Pte. Ltd.	In force	Dec 2, 2026	Jun 2, 2027	Term ends Jul 24, 2028	High confidence
US 9,048,228	Integrated Circuit Packaging System with Side Solderable Leads and Method of Manufacture Thereof Stats ChipPAC Pte. Ltd. In force Fee due Dec 2, 2026 Lapses if unpaid Jun 2, 2027 Term ends Nov 28, 2033 · High confidence	Stats ChipPAC Pte. Ltd.	In force	Dec 2, 2026	Jun 2, 2027	Term ends Nov 28, 2033	High confidence
US 9,059,011	Exposed Interconnect for a Package on Package System Stats ChipPAC Pte. Ltd. In force Fee due Dec 16, 2026 Lapses if unpaid Jun 16, 2027 Term ends Oct 21, 2028 · High confidence	Stats ChipPAC Pte. Ltd.	In force	Dec 16, 2026	Jun 16, 2027	Term ends Oct 21, 2028	High confidence
US 9,059,074	Integrated Circuit Package System with Planar Interconnect Stats ChipPAC Pte. Ltd. In force Fee due Dec 16, 2026 Lapses if unpaid Jun 16, 2027 Term ends Jun 25, 2030 · High confidence	Stats ChipPAC Pte. Ltd.	In force	Dec 16, 2026	Jun 16, 2027	Term ends Jun 25, 2030	High confidence
US 9,059,151	Integrated Circuit Packaging System with Island Terminals and Embedded Paddle and Method of Manufacture Thereof Stats ChipPAC Pte. Ltd. In force Fee due Dec 16, 2026 Lapses if unpaid Jun 16, 2027 Term ends Dec 15, 2032 · High confidence	Stats ChipPAC Pte. Ltd.	In force	Dec 16, 2026	Jun 16, 2027	Term ends Dec 15, 2032	High confidence
US 11,688,612	Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die STATS ChipPAC Pte. Ltd. In force Fee due Dec 27, 2026 Lapses if unpaid Jun 28, 2027 Term ends Dec 15, 2031 · High confidence	STATS ChipPAC Pte. Ltd.	In force	Dec 27, 2026	Jun 28, 2027	Term ends Dec 15, 2031	High confidence
30 more maintenance fees coming due in the 12 months from Nov 14, 2026 · Pro

10 of 40 patents shown. Soonest fee due date first, then patent number.

Pro members see every patent with a maintenance fee coming due: number, title, status, the due date, and the date it lapses if the fee goes unpaid through the grace period.

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Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.