Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP

Stats ChipPAC, Ltd.

A patent family: one line of work, grouped by real continuity rather than by a technology label inferred from titles. 6 of these applications claim priority to application 13/832,809, filed Mar 15, 2013. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.

Patent	Title	Holder	Status	Expires	Time remaining	Confidence
US 9,496,195	Semiconductor Device and Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP Stats ChipPAC Pte. Lte. In force Term ends Mar 15, 2033 · High confidence	Stats ChipPAC Pte. Lte.	In force	Term ends Mar 15, 2033	Term ends Mar 15, 2033	High confidence
US 10,181,423	Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging STATS ChipPAC Pte. Ltd. In force Term ends Mar 15, 2033 · High confidence	STATS ChipPAC Pte. Ltd.	In force	Term ends Mar 15, 2033	Term ends Mar 15, 2033	High confidence
US 10,515,828	Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP Stats ChipPAC Pte. Ltd. In force Term ends Mar 15, 2033 · High confidence	Stats ChipPAC Pte. Ltd.	In force	Term ends Mar 15, 2033	Term ends Mar 15, 2033	High confidence
US 11,011,423	Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging STATS ChipPAC Pte. Ltd. In force Term ends Mar 15, 2033 · High confidence	STATS ChipPAC Pte. Ltd.	In force	Term ends Mar 15, 2033	Term ends Mar 15, 2033	High confidence
US 11,222,793	Semiconductor Device with Encapsulant Deposited Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP Stats ChipPAC Pte. Ltd. In force Term ends Mar 15, 2033 · High confidence	Stats ChipPAC Pte. Ltd.	In force	Term ends Mar 15, 2033	Term ends Mar 15, 2033	High confidence
US 9,620,413	Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging Stats ChipPAC Pte. Lte. In force Term ends Jul 18, 2033 · High confidence	Stats ChipPAC Pte. Lte.	In force	Term ends Jul 18, 2033	Term ends Jul 18, 2033	High confidence
US 11,961,764	Semiconductor Device and Method of Making a Wafer-Level Chip-Scale Package STATS ChipPAC Pte. Ltd. In force Term ends Aug 9, 2033 · High confidence	STATS ChipPAC Pte. Ltd.	In force	Term ends Aug 9, 2033	Term ends Aug 9, 2033	High confidence
US 12,094,729	Semiconductor Device with Encapsulant Deposited Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP Stats ChipPAC Pte. Ltd. In force Term ends Nov 3, 2033 · High confidence	Stats ChipPAC Pte. Ltd.	In force	Term ends Nov 3, 2033	Term ends Nov 3, 2033	High confidence

8 of 8 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.

6 of these are in force and held by Stats ChipPAC, Ltd..

Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.