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Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package

Stats ChipPAC, Ltd.

A patent family: one line of work, grouped by real continuity rather than by a technology label inferred from titles. 5 of these applications claim priority to application 61/952,620, filed Mar 13, 2014. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
PatentTitleHolderStatusExpiresTime remainingConfidence
US 9,527,723Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
In force
 · High confidence
Stats ChipPAC, Ltd.In force
High confidence
US 10,189,702Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
In force
 · High confidence
STATS ChipPAC Pte. Ltd.In force
High confidence
US 10,662,056Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
In force
 · High confidence
STATS ChipPAC Pte. Ltd.In force
High confidence
US 11,370,655Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
In force
 · High confidence
Stats ChipPAC Pte. Ltd.In force
High confidence
US 12,319,564Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package
In force
 · High confidence
Stats ChipPAC Pte. Ltd.In force
High confidence
5 of 5 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
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