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Semiconductor Device and Method of Forming MEMS Package

Stats ChipPAC, Ltd.

A patent family: one line of work, grouped by real continuity rather than by a technology label inferred from titles. 3 of these applications claim priority to application 62/108,664, filed Jan 28, 2015. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
PatentTitleHolderStatusExpiresTime remainingConfidence
US 9,701,534Semiconductor Device and Method of Forming MEMS Package
In force
 · High confidence
Stats ChipPAC, Ltd.In force
High confidence
US 10,730,745Semiconductor Device and Method of Forming MEMS Package
In force
 · High confidence
STATS ChipPAC Pte. Ltd.In force
High confidence
US 11,319,207Semiconductor Device and Method of Forming MEMS Package
In force
 · High confidence
Stats ChipPAC Pte. Ltd.In force
High confidence
3 of 3 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
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