Antenna In Embedded Wafer-Level Ball-Grid Array Package
A patent family: one line of work, grouped by real continuity rather than by a technology label
inferred from titles. 5 of these applications claim priority to application 62/198,522, filed Jul 29, 2015. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
| Patent | Title | Holder | Status | Expires | Time remaining | Confidence |
|---|---|---|---|---|---|---|
| US 9,806,040 | Antenna In Embedded Wafer-Level Ball-Grid Array Package In force · High confidence | Stats ChipPAC Pte. Ltd. | In force | High confidence | ||
| US 10,211,171 | Antenna in Embedded Wafer-Level Ball-Grid Array Package In force · High confidence | STATS ChipPAC Pte. Ltd. | In force | High confidence | ||
| US 10,636,753 | Antenna in Embedded Wafer-Level Ball-Grid Array Package In force · High confidence | Stats ChipPAC Pte. Ltd. | In force | High confidence | ||
| US 11,469,191 | Antenna in Embedded Wafer-Level Ball-Grid Array Package In force · High confidence | Stats ChipPAC Pte. Ltd. | In force | High confidence | ||
| US 12,094,843 | Antenna in Embedded Wafer-Level Ball-Grid Array Package In force · High confidence | Stats ChipPAC Pte. Ltd. | In force | High confidence |
5 of 5 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.