Steag Hamatech, Inc.
Records under this name other than patents Steag Hamatech, Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
Showing 1 to 8 of 8 · Back to Steag Hamatech, Inc.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 6,460,730 | Method and device for dispensing a fluid from a pressure tank Lapsed on the fee record Ended Oct 8, 2010 · From the USPTO record | Lapsed on the fee record | Ended Oct 8, 2010 | From the USPTO record |
| US 6,355,129 | System and method for thermally manipulating a combination of a top and bottom substrate before a curing operation Lapsed on the fee record Ended Mar 12, 2010 · From the USPTO record | Lapsed on the fee record | Ended Mar 12, 2010 | From the USPTO record |
| US 6,332,944 | Substrate design for bonded storage disks and method of making same Lapsed on the fee record Ended Dec 25, 2009 · From the USPTO record | Lapsed on the fee record | Ended Dec 25, 2009 | From the USPTO record |
| US 6,511,616 | System and method for curing a resin disposed between a top and bottom substrate with thermal management Lapsed on the fee record Ended Jan 28, 2007 · From the USPTO record | Lapsed on the fee record | Ended Jan 28, 2007 | From the USPTO record |
| US 6,500,297 | Method of forming bonded storage disks with low power light assembly Lapsed on the fee record Ended Dec 31, 2006 · From the USPTO record | Lapsed on the fee record | Ended Dec 31, 2006 | From the USPTO record |
| US 6,430,803 | Method for maintaining concentricity of a combination of a top and bottom substrate during the assembly of a bonded storage disk Lapsed on the fee record Ended Aug 13, 2006 · From the USPTO record | Lapsed on the fee record | Ended Aug 13, 2006 | From the USPTO record |
| US 6,352,612 | System for forming bonded storage disks with low power light assembly Lapsed on the fee record Ended Mar 5, 2006 · From the USPTO record | Lapsed on the fee record | Ended Mar 5, 2006 | From the USPTO record |
| US 6,254,809 | System and method for curing a resin disposed between a top and bottom substrate with thermal management Lapsed on the fee record Ended Jul 3, 2005 · From the USPTO record | Lapsed on the fee record | Ended Jul 3, 2005 | From the USPTO record |