Stratec Consumables GmbH
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
1
Ending by 2030
Feb 2030
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Mar 15, 2027The maintenance fee for Method and substrates for forming crystals (US 9,136,099) comes due Mar 15, 2027. Unpaid by Sep 15, 2027, it lapses early.
- 1 fee due Apr 6, 2027The maintenance fee for Fusing method of substrate layer, manufacturing method of microfluidic chip and fusing apparatus of substrate layer (US 9,150,411) comes due Apr 6, 2027. Unpaid by Oct 6, 2027, it lapses early.
- 2 fees due May 3 to 17, 2027 · next May 3
- 1 fee due Oct 7, 2027The maintenance fee for Method of producing a polymer part and polymer part (US 10,611,890) comes due Oct 7, 2027. Unpaid by Apr 7, 2028, it lapses early.
Recent changes
- 1 of the patents on this record was granted since Aug 17, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,811,790 | Method for manufacturing an optical waveguide, optical waveguide, and sensor arrangement In force · From the USPTO record | In force | From the USPTO record | |
| US 9,176,030 | Substrate and target plate In force · From the USPTO record | In force | From the USPTO record | |
| US 8,691,039 | Method and device for thermocompression bonding In force · From the USPTO record | In force | From the USPTO record | |
| US 9,956,722 | Method and device for thermocompression bonding In force · From the USPTO record | In force | From the USPTO record | |
| US 8,877,320 | Microfluidic devices and methods of manufacture thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 9,136,099 | Method and substrates for forming crystals In force · From the USPTO record | In force | From the USPTO record | |
| US 9,150,411 | Fusing method of substrate layer, manufacturing method of microfluidic chip and fusing apparatus of substrate layer In force · From the USPTO record | In force | From the USPTO record | |
| US 9,823,221 | Microstructured polymer devices In force · From the USPTO record | In force | From the USPTO record | |
| US 10,675,619 | Method for manufacturing a microfluidic device In force · From the USPTO record | In force | From the USPTO record | |
| US 9,188,991 | Microfluidic device and a method of manufacturing a microfluidic device In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 19: 1 lapsed for an unpaid fee. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
1 pending · 4 no status recorded