Subtron Technology Co., Ltd.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 3 name spellings.
5
Ending by 2030
Dec 2026
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Dec 11, 2026The maintenance fee for Package carrier (US 10,319,610) comes due Dec 11, 2026. Unpaid by Jun 11, 2027, it lapses early.
- 1 fee due Mar 19, 2027The maintenance fee for Waveguide structure (US 11,764,451) comes due Mar 19, 2027. Unpaid by Sep 20, 2027, it lapses early.
- 1 fee due Jun 1, 2027The maintenance fee for Circuit board and manufacturing method thereof (US 9,204,546) comes due Jun 1, 2027. Unpaid by Dec 1, 2027, it lapses early.
- 1 fee due Jul 26, 2027The maintenance fee for Cover structure and manufacturing method thereof (US 9,247,632) comes due Jul 26, 2027. Unpaid by Jan 26, 2028, it lapses early.
- 1 fee due Oct 12, 2027The maintenance fee for Substrate structure and manufacturing method thereof (US 9,313,886) comes due Oct 12, 2027. Unpaid by Apr 12, 2028, it lapses early.
- 1 fee due Nov 3, 2027The maintenance fee for Package carrier and manufacturing method thereof (US 9,330,941) comes due Nov 3, 2027. Unpaid by May 3, 2028, it lapses early.
Recent changes
- 2 terms have ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,540,969 | High thermal conducting circuit substrate and manufacturing process thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 7,838,338 | Fabricating process of thermal enhanced substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 7,786,501 | Fabricating process and structure of thermal enhanced substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 9,961,784 | Manufacturing method of circuit substrate In force · From the USPTO record | In force | From the USPTO record | |
| US 8,563,363 | Fabricating method of semiconductor package structure In force · From the USPTO record | In force | From the USPTO record | |
| US 8,390,013 | Semiconductor package structure and fabricating method of semiconductor package structure In force · From the USPTO record | In force | From the USPTO record | |
| US 8,441,121 | Package carrier and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,415,780 | Package carrier and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,737,081 | Cover structure and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 9,532,494 | Manufacturing method of package structure In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 38: 40 lapsed for an unpaid fee · 2 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
36 no status recorded