Super Group Semiconductor Co., Ltd.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
4
Ending by 2030
May 2030
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Feb 13, 2027The maintenance fee for Fan-out wafer level chip package structure (US 10,381,268) comes due Feb 13, 2027. Unpaid by Aug 13, 2027, it lapses early.
- 1 fee due Mar 8, 2027The maintenance fee for Trench power MOSFET and manufacturing method thereof (US 9,130,035) comes due Mar 8, 2027. Unpaid by Sep 8, 2027, it lapses early.
- 1 fee due Apr 15, 2027The maintenance fee for Trench power semiconductor device and manufacturing method thereof (US 10,446,658) comes due Apr 15, 2027. Unpaid by Oct 15, 2027, it lapses early.
- 3 fees due Jun 3 to 24, 2027 · next Jun 3
- 1 fee due Jul 7, 2027The maintenance fee for Trench power semiconductor component and method of manufacturing the same (US 10,529,847) comes due Jul 7, 2027. Unpaid by Jan 7, 2028, it lapses early.
- 1 fee due Aug 11, 2027The maintenance fee for Manufacturing method of a trench power semiconductor device (US 10,559,674) comes due Aug 11, 2027. Unpaid by Feb 11, 2028, it lapses early.
- 1 fee due Sep 29, 2027The maintenance fee for Package structure and packaging method of wafer level chip scale package (US 9,299,592) comes due Sep 29, 2027. Unpaid by Mar 29, 2028, it lapses early.
- 1 fee due Oct 21, 2027The maintenance fee for Manufacturing method of a chip package structure (US 10,629,452) comes due Oct 21, 2027. Unpaid by Apr 21, 2028, it lapses early.
- 1 fee due Nov 10, 2027The maintenance fee for Manufacturing method of wafer level chip scale package structure (US 9,337,049) comes due Nov 10, 2027. Unpaid by May 10, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,994,001 | Trenched power semiconductor structure with schottky diode and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,525,256 | Power semiconductor structure with schottky diode In force · From the USPTO record | In force | From the USPTO record | |
| US 8,153,490 | Fabrication method of power semiconductor structure with reduced gate impedance In force · From the USPTO record | In force | From the USPTO record | |
| US 8,080,457 | Fabrication method of power semiconductor structure with low gate charge In force · From the USPTO record | In force | From the USPTO record | |
| US 8,357,952 | Power semiconductor structure with field effect rectifier and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,354,315 | Fabrication method of a power semicondutor structure with schottky diode In force · From the USPTO record | In force | From the USPTO record | |
| US 8,421,149 | Trench power MOSFET structure with high switching speed and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,445,958 | Power semiconductor device with trench bottom polysilicon and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,900,950 | Trench Power MOSFET Structure with High Cell Density and Fabrication Method Thereof In force · High confidence | In force | High confidence | |
| US 8,975,691 | Trenched power MOSFET with enhanced breakdown voltage and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 44: 11 lapsed for an unpaid fee. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
2 pending · 3 no status recorded