Taiwan Microloops Corp.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
Apr 2036
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due May 19, 2027The maintenance fee for Thermal conduction structrure and manufacturing method thereof (US 10,483,190) comes due May 19, 2027. Unpaid by Nov 19, 2027, it lapses early.
- 1 fee due Aug 6, 2027The maintenance fee for Combination structure of vapor chamber and heat pipe (US 11,892,240) comes due Aug 6, 2027. Unpaid by Feb 7, 2028, it lapses early.
Recent changes
- 1 of the patents on this record was granted since Aug 17, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 9,841,246 | Dual material vapor chamber and upper shell thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 10,018,427 | Vapor chamber structure In force · From the USPTO record | In force | From the USPTO record | |
| US 10,012,445 | Vapor chamber and heat pipe combined structure In force · From the USPTO record | In force | From the USPTO record | |
| US 10,288,356 | Vapor Chamber and Heat Pipe Combined Structure and Combining Method Thereof In force · High confidence | In force | High confidence | |
| US 10,048,015 | Liquid-vapor separating type heat conductive structure In force · From the USPTO record | In force | From the USPTO record | |
| US 10,483,190 | Thermal conduction structrure and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US D1,026,838 | Heat dissipation module In force · From the USPTO record | In force | From the USPTO record | |
| US 10,927,842 | Cooling fan module In force · From the USPTO record | In force | From the USPTO record | |
| US 11,044,832 | Water-cooled distributive heat dissipation system for rack In force · From the USPTO record | In force | From the USPTO record | |
| US 11,044,833 | Water-cooled pressurized distributive heat dissipation system for rack In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 26: 1 lapsed for an unpaid fee. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
6 abandoned · 34 no status recorded