Tanaka Electronics Co., Ltd.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Previously recorded as Tanaka Denshi Kogyo K.K. (to 2026)
0
Ending by 2030
Oct 2039
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Jul 16, 2027The maintenance fee for Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor device (US 11,876,066) comes due Jul 16, 2027. Unpaid by Jan 18, 2028, it lapses early.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
Showing 1 to 6 of 6
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 11,289,442 | Gold-Coated Silver Bonding Wire and Manufacturing Method Thereof, and Semiconductor Device and Manufacturing Method Thereof In force · High confidence | In force | High confidence | |
| US 12,087,724 | Palladium-coated copper bonding wire and method for manufacturing same In force · From the USPTO record | In force | From the USPTO record | |
| US 12,237,293 | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 11,876,066 | Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor device In force · From the USPTO record | In force | From the USPTO record | |
| US 11,996,382 | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 12,692,576 | Aluminum Bonding Wire for Power Semiconductor In force · High confidence | In force | High confidence |
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.