The Panda Project
Records under this name other than patents The Panda Project holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 6,073,229 | Computer system having a modular architecture Term ended Term ended Sep 2, 2017 · From the USPTO record | Term ended | Term ended Sep 2, 2017 | From the USPTO record |
| US D447,143 | Computer cabinet Formerly held Term ended Term ended Aug 28, 2015 · From the USPTO record | Term ended | Term ended Aug 28, 2015 | From the USPTO record |
| US D430,565 | Computer cabinet Formerly held Term ended Term ended Sep 5, 2014 · From the USPTO record | Term ended | Term ended Sep 5, 2014 | From the USPTO record |
| US 7,103,753 | Backplane System Having High-Density Electrical Connectors Formerly held Term ended Ended no later than Aug 28, 2014 · Low confidence | Term ended | Ended no later than Aug 28, 2014 | Low confidence |
| US 6,574,726 | Modular architecture for high bandwidth computers Term ended Term ended Mar 11, 2014 · From the USPTO record | Term ended | Term ended Mar 11, 2014 | From the USPTO record |
| US 7,803,020 | Backplane System Having High-Density Electrical Connectors Formerly held Term ended Term ended Mar 11, 2014 · Medium confidence | Term ended | Term ended Mar 11, 2014 | Medium confidence |
| US 6,141,869 | Apparatus for and method of manufacturing a semiconductor die carrier Formerly held Lapsed on the fee record Ended Nov 7, 2012 · From the USPTO record | Lapsed on the fee record | Ended Nov 7, 2012 | From the USPTO record |
| US 6,339,191 | Prefabricated semiconductor chip carrier Formerly held Lapsed on the fee record Ended Jan 15, 2010 · From the USPTO record | Lapsed on the fee record | Ended Jan 15, 2010 | From the USPTO record |
| US 6,305,987 | Integrated connector and semiconductor die package Formerly held Lapsed on the fee record Ended Oct 23, 2009 · From the USPTO record | Lapsed on the fee record | Ended Oct 23, 2009 | From the USPTO record |
| US 6,307,258 | Open-cavity semiconductor die package Formerly held Lapsed on the fee record Ended Oct 23, 2009 · From the USPTO record | Lapsed on the fee record | Ended Oct 23, 2009 | From the USPTO record |