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Method for Reducing Metal Contamination and Film Deposition Apparatus

Tokyo Electron Limited

A patent family: one line of work, grouped by real continuity rather than by a technology label inferred from titles. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
PatentTitleHolderStatusExpiresTime remainingConfidence
US 11,214,864Method for Reducing Metal Contamination and Film Deposition Apparatus
In force
 · High confidence
Tokyo Electron LimitedIn force
High confidence
US 10,424,491Etching Method
In force
 · High confidence
Tokyo Electron LimitedIn force
High confidence
US 10,607,835Etching Method
In force
 · High confidence
Tokyo Electron LimitedIn force
High confidence
US 10,748,758Method for Depositing a Silicon Nitride Film and Film Deposition Apparatus
In force
 · High confidence
Tokyo Electron LimitedIn force
High confidence
US 10,553,409Method of Cleaning Plasma Processing Apparatus
In force
 · High confidence
Tokyo Electron LimitedIn force
High confidence
US 10,593,541Film Deposition Method
In force
 · High confidence
Tokyo Electron LimitedIn force
High confidence
US 10,366,888Pattern Forming Method
In force
 · High confidence
Tokyo Electron Limited and Tokyo Ohka Kogyo Co., Ltd.In force
High confidence
US 10,651,077Etching Method
In force
 · High confidence
Tokyo Electron LimitedIn force
High confidence
US 10,665,416Substrate Processing Apparatus
In force
 · High confidence
Tokyo Electron LimitedIn force
High confidence
US 11,462,444Substrate Container, Controller, and Abnormality Detection Method
In force
 · High confidence
Tokyo Electron LimitedIn force
High confidence
43 more patents in this group · Pro
10 of 53 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.
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40 of these are in force and held by Tokyo Electron Limited.
Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
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