Tongfu Microelectronics Co., Ltd.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 2 name spellings.
0
Ending by 2030
Oct 2031
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 26, 2026The maintenance fee for Fan-out high-density packaging methods and structures (US 9,040,347) comes due Nov 26, 2026. Unpaid by May 26, 2027, it lapses early.
- 1 fee due Dec 6, 2026The maintenance fee for Semiconductor chip package device (US 11,670,571) comes due Dec 6, 2026. Unpaid by Jun 7, 2027, it lapses early.
- 1 fee due Feb 4, 2027The maintenance fee for Three-dimensional system-level packaging methods and structures (US 9,099,448) comes due Feb 4, 2027. Unpaid by Aug 4, 2027, it lapses early.
- 1 fee due Apr 17, 2027The maintenance fee for Semiconductor packaging structure (US 11,791,310) comes due Apr 17, 2027. Unpaid by Oct 18, 2027, it lapses early.
- 1 fee due Jun 24, 2027The maintenance fee for 3D system-level packaging methods and structures (US 10,515,883) comes due Jun 24, 2027. Unpaid by Dec 27, 2027, it lapses early.
- 2 fees due Sep 22, 2027
- 3 fees due Oct 2 to 26, 2027 · next Oct 2
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,883,627 | Method for chip packaging In force · From the USPTO record | In force | From the USPTO record | |
| US 9,362,173 | Method for chip package In force · From the USPTO record | In force | From the USPTO record | |
| US 9,324,583 | Packaging method In force · From the USPTO record | In force | From the USPTO record | |
| US 9,040,347 | Fan-out high-density packaging methods and structures In force · From the USPTO record | In force | From the USPTO record | |
| US 9,099,448 | Three-dimensional system-level packaging methods and structures In force · From the USPTO record | In force | From the USPTO record | |
| US 9,543,269 | System-level packaging methods and structures In force · From the USPTO record | In force | From the USPTO record | |
| US 9,595,490 | 3D system-level packaging methods and structures In force · From the USPTO record | In force | From the USPTO record | |
| US 10,515,883 | 3D system-level packaging methods and structures In force · From the USPTO record | In force | From the USPTO record | |
| US 10,741,499 | System-level packaging structures In force · From the USPTO record | In force | From the USPTO record | |
| US 9,497,862 | Packaging structure In force · From the USPTO record | In force | From the USPTO record |
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
5 pending · 6 no status recorded