Touch Future Technology Ltd.
Records under this name other than patents Touch Future Technology Ltd. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned.
Showing 1 to 6 of 6 · Back to Touch Future Technology Ltd.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 6,534,861 | Ball grid substrate for lead-on-chip semiconductor package Lapsed on the fee record Ended Mar 18, 2011 · From the USPTO record | Lapsed on the fee record | Ended Mar 18, 2011 | From the USPTO record |
| US 6,501,168 | Substrate for an integrated circuit package Lapsed on the fee record Ended Dec 31, 2010 · From the USPTO record | Lapsed on the fee record | Ended Dec 31, 2010 | From the USPTO record |
| US 6,300,165 | Ball grid substrate for lead-on-chip semiconductor package Lapsed on the fee record Ended Oct 9, 2009 · From the USPTO record | Lapsed on the fee record | Ended Oct 9, 2009 | From the USPTO record |
| US 6,248,612 | Method for making a substrate for an integrated circuit package Lapsed on the fee record Ended Jun 19, 2009 · From the USPTO record | Lapsed on the fee record | Ended Jun 19, 2009 | From the USPTO record |
| US 6,801,438 | Electrical circuit and method of formation Lapsed on the fee record Ended Oct 5, 2008 · From the USPTO record | Lapsed on the fee record | Ended Oct 5, 2008 | From the USPTO record |
| US 6,107,683 | Sequentially built integrated circuit package Lapsed on the fee record Ended Aug 22, 2008 · From the USPTO record | Lapsed on the fee record | Ended Aug 22, 2008 | From the USPTO record |