Vishay General Semiconductor, LLC
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 3 name spellings.
15
Ending by 2030
Jan 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Mar 19, 2027The maintenance fee for Package assembly for plating with selective molding (US 11,764,075) comes due Mar 19, 2027. Unpaid by Sep 20, 2027, it lapses early.
- 1 fee due May 3, 2027The maintenance fee for Trench Mos Device Having a Termination Structure with Multiple Field-Relaxation Trenches for High Voltage Applications (US 9,178,015) comes due May 3, 2027. Unpaid by Nov 3, 2027, it lapses early.
- 1 fee due Jun 1, 2027The maintenance fee for Zener diode haviing a polysilicon layer for improved reverse surge capability and decreased leakage current (US 9,202,935) comes due Jun 1, 2027. Unpaid by Dec 1, 2027, it lapses early.
- 1 fee due Jul 16, 2027The maintenance fee for Semiconductor package and packaging process for side-wall plating with a conductive film (US 11,876,003) comes due Jul 16, 2027. Unpaid by Jan 18, 2028, it lapses early.
- 1 fee due Aug 16, 2027The maintenance fee for Electrical press-fit pin for a semiconductor module (US 9,263,820) comes due Aug 16, 2027. Unpaid by Feb 16, 2028, it lapses early.
- 1 fee due Sep 8, 2027The maintenance fee for GaN-based schottky diode having large bond pads and reduced contact resistance (US 9,281,417) comes due Sep 8, 2027. Unpaid by Mar 8, 2028, it lapses early.
Recent changes
- 1 term has ended since Aug 17, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 8,114,709 | Electronic device and lead frame In force · From the USPTO record | In force | From the USPTO record | |
| US 7,560,355 | Semiconductor wafer suitable for forming a semiconductor junction diode device and method of forming same In force · From the USPTO record | In force | From the USPTO record | |
| US 7,719,096 | Semiconductor device and method for manufacturing a semiconductor device In force · From the USPTO record | In force | From the USPTO record | |
| US 8,269,338 | Semiconductor device having improved heat dissipation capabilities In force · From the USPTO record | In force | From the USPTO record | |
| US 7,737,533 | Low voltage transient voltage suppressor with tapered recess extending into substrate of device allowing for reduced breakdown voltage In force · From the USPTO record | In force | From the USPTO record | |
| US 8,048,714 | Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities In force · From the USPTO record | In force | From the USPTO record | |
| US 8,421,214 | Semiconductor device and method for manufacturing a semiconductor device In force · From the USPTO record | In force | From the USPTO record | |
| US 8,982,524 | Low Forward Voltage Drop Transient Voltage Suppressor and Method of Fabricating In force · Low confidence | In force | Low confidence | |
| US 8,198,709 | Potted integrated circuit device with aluminum case In force · From the USPTO record | In force | From the USPTO record | |
| US 7,755,102 | High breakdown voltage diode and method of forming same In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 33: 14 lapsed for an unpaid fee · 9 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
2 pending · 7 no status recorded