Volantis Semiconductor, Inc.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
Jan 2045
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
No maintenance fee falls due on this company's record before Nov 14, 2027.
Recent changes
- 5 of the patents on this record were granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
Showing 1 to 5 of 5
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 12,721,191 | Back Side Power Delivery for Wafer-Scale Integration with Solderless Modular Power Substrates In force · High confidence | In force | High confidence | |
| US 12,787,813 | Back Side Power Delivery for Wafer-Scale Integration with an Isometric Grid Compression Plate In force · High confidence | In force | High confidence | |
| US 12,721,244 | Wafer-Scale Integration with a Stiffening Isometric Grid Array In force · High confidence | In force | High confidence | |
| US 12,713,921 | Cold Plate Cooling for Wafer-Scale Integration with Back Side Modular Power Delivery In force · High confidence | In force | High confidence | |
| US 12,748,260 | Wafer Level Optical Routing In force · High confidence | In force | High confidence |
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.