Win Semiconductors Corp.
1 more in force is now held by another company
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 3 name spellings.
5
Ending by 2030
Dec 2026
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 21, 2026The maintenance fee for Protection structure for semiconductor device package (US 10,298,203) comes due Nov 21, 2026. Unpaid by May 21, 2027, it lapses early.
- 3 fees due Jan 4 to 23, 2027 · next Jan 4
- 1 fee due Feb 6, 2027The maintenance fee for Compound semiconductors having an improved high temperature resistant backside metallization (US 10,374,129) comes due Feb 6, 2027. Unpaid by Aug 6, 2027, it lapses early.
- 1 fee due Mar 10, 2027The maintenance fee for Structure for reducing compound semiconductor wafer distortion (US 10,410,979) comes due Mar 10, 2027. Unpaid by Sep 10, 2027, it lapses early.
- 4 fees due Apr 1 to 22, 2027 · next Apr 1
- 1 fee due May 17, 2027The maintenance fee for Structure of a semiconductor chip with substrate via holes and metal bumps and a fabrication method thereof (US 9,190,374) comes due May 17, 2027. Unpaid by Nov 17, 2027, it lapses early.
- 1 fee due Jun 3, 2027The maintenance fee for Protective cover for an acoustic wave device and fabrication method thereof (US 10,498,310) comes due Jun 3, 2027. Unpaid by Dec 3, 2027, it lapses early.
- 1 fee due Aug 4, 2027The maintenance fee for Heterojunction bipolar transistor (US 10,553,709) comes due Aug 4, 2027. Unpaid by Feb 4, 2028, it lapses early.
- 4 fees due Sep 3 to 30, 2027 · next Sep 3
- 2 fees due Oct 2 to 23, 2027 · next Oct 2
- 1 fee due Nov 5, 2027The maintenance fee for Compound semiconductor monolithic integrated circuit device with transistors and diodes (US 10,643,993) comes due Nov 5, 2027. Unpaid by May 5, 2028, it lapses early.
Recent changes
- 2 of the patents on this record were granted since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,420,417 | Two-port dual-gate HEMT for discrete device application In force · From the USPTO record | In force | From the USPTO record | |
| US 7,842,591 | Method of fabricating short-gate-length electrodes for integrated III-V compound semiconductor devices In force · From the USPTO record | In force | From the USPTO record | |
| US 7,679,870 | On-chip ESD protection circuit using enhancement-mode HEMT/MESFET technology In force · From the USPTO record | In force | From the USPTO record | |
| US 7,705,361 | Heterojunction Bipolar Transistor Having (IN) (AL) Gaassb/Ingaas Base-Collector Structure In force · High confidence | In force | High confidence | |
| US 8,003,532 | Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film In force · From the USPTO record | In force | From the USPTO record | |
| US 9,287,175 | Fabrication method for dicing of semiconductor wafers using laser cutting techniques In force · From the USPTO record | In force | From the USPTO record | |
| US 8,969,973 | Multi-gate semiconductor devices In force · From the USPTO record | In force | From the USPTO record | |
| US 8,497,206 | Method of processing backside copper layer for semiconductor chips In force · From the USPTO record | In force | From the USPTO record | |
| US 8,911,551 | Electroless plating apparatus and method In force · From the USPTO record | In force | From the USPTO record | |
| US 8,835,283 | Fabrication method for producing semiconductor chips with enhanced die strength In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 89: 1 patent in force now held by others · 13 lapsed for an unpaid fee · 1 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
5 pending · 35 no status recorded