Semiconductor Memory Device and Manufacturing Method Thereof

Winbond Electronics Corp.

A patent family: one line of work, grouped by real continuity rather than by a technology label inferred from titles. 2 of these applications claim priority to application 14/621,344, filed Feb 12, 2015. A shared origin can cover several different claimed inventions, which is why members here may not share a title. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.

Patent	Title	Holder	Status	Expires	Time remaining	Confidence
US 9,449,697	Semiconductor Memory Device and Manufacturing Method Thereof Winbond Electronics Corp. In force Term ends Feb 12, 2035 · High confidence	Winbond Electronics Corp.	In force	Term ends Feb 12, 2035	Term ends Feb 12, 2035	High confidence
US 9,768,184	Manufacturing Method of Semiconductor Memory Device Winbond Electronics Corp. In force Term ends Feb 12, 2035 · High confidence	Winbond Electronics Corp.	In force	Term ends Feb 12, 2035	Term ends Feb 12, 2035	High confidence
US 9,935,116	Manufacturing Method of Semiconductor Memory Device Winbond Electronics Corp. In force Term ends Feb 12, 2035 · High confidence	Winbond Electronics Corp.	In force	Term ends Feb 12, 2035	Term ends Feb 12, 2035	High confidence

3 of 3 records shown. In-force patents first, soonest term end first, then patent number. Expired patents follow, in the same order.

Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.