Xintec Inc.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
Recorded under 2 name spellings.
19
Ending by 2030
Jan 2027
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.
- 1 fee due Nov 19, 2026The maintenance fee for Chip package and method for forming the same (US 9,035,456) comes due Nov 19, 2026. Unpaid by May 19, 2027, it lapses early.
- 3 fees due Dec 9 to 23, 2026 · next Dec 9
- 5 fees due Jan 4 to 28, 2027 · next Jan 4
- 1 fee due Feb 20, 2027The maintenance fee for Wafer coating system and method of manufacturing chip package (US 10,388,541) comes due Feb 20, 2027. Unpaid by Aug 20, 2027, it lapses early.
- 5 fees due Mar 5 to 24, 2027 · next Mar 5
- 6 fees due Apr 6 to 29, 2027 · next Apr 6
- 10 fees due May 3 to 24, 2027 · next May 3
- 3 fees due Jun 8 to 22, 2027 · next Jun 8
- 4 fees due Jul 5 to 16, 2027 · next Jul 5
- 2 fees due Aug 23, 2027
- 7 fees due Sep 1 to 26, 2027 · next Sep 1
- 4 fees due Oct 5 to 30, 2027 · next Oct 5
- 6 fees due Nov 3 to 10, 2027 · next Nov 3
Recent changes
- 3 of the patents on this record were granted since Aug 16, 2026
- 4 terms have ended since Aug 16, 2026
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 7,576,425 | Conducting layer in chip package module In force · From the USPTO record | In force | From the USPTO record | |
| US 8,076,744 | Photosensitizing chip package and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 9,190,362 | Image Sensor Package with Trench Insulator and Fabrication Method Thereof In force · High confidence | In force | High confidence | |
| US 8,232,202 | Image sensor package and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,097,929 | Electronics device package and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 7,968,448 | Semiconductor device and manufacturing method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 8,237,187 | Package structure for chip and method for forming the same In force · From the USPTO record | In force | From the USPTO record | |
| US 8,319,347 | Electronic device package and fabrication method thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 9,196,571 | Chip device packages and fabrication methods thereof In force · From the USPTO record | In force | From the USPTO record | |
| US 9,305,842 | Fabrication methods of chip device packages In force · From the USPTO record | In force | From the USPTO record |
Also on record, not counted in the 217: 64 lapsed for an unpaid fee · 18 ended at full term. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
10 pending · 2 abandoned · 52 no status recorded