Ymt Co., Ltd.
Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.
0
Ending by 2030
Dec 2034
Next term end
When these terms end
Held patents by the year their term ends
20262027202820292030203120322033203420352036203720382039204020412042204320442045
Fee deadlines
No maintenance fee falls due on this company's record before Nov 14, 2027.
Recent changes
Nothing was recorded against this company's patents in the last 90 days.
Patents held now
Soonest term end first. Each date below is computed on that patent's own page, which shows the rule, the adjustments and the fee history it was derived from.
Showing 1 to 9 of 9
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| US 9,803,098 | Conductive ink In force · From the USPTO record | In force | From the USPTO record | |
| US 9,758,889 | Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby In force · From the USPTO record | In force | From the USPTO record | |
| US 11,028,495 | Method for producing porous copper foil and porous copper foil produced by the same In force · From the USPTO record | In force | From the USPTO record | |
| US 11,499,233 | Plated laminate and printed circuit board In force · From the USPTO record | In force | From the USPTO record | |
| US 12,139,811 | Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the same In force · From the USPTO record | In force | From the USPTO record | |
| US 12,495,494 | Metal foil, carrier with metal foil comprising the same and printed circuit board including the same In force · From the USPTO record | In force | From the USPTO record | |
| US 12,408,279 | Release Layer for Metal Foil with Carrier and Metal Foil Comprising the Same In force · High confidence | In force | High confidence | |
| US 12,534,426 | Leveler and Electroplating Composition for Filling via Hole In force · High confidence | In force | High confidence | |
| US 12,522,559 | Leveling Agent and Electrolytic Composition for Filling via Hole In force · High confidence | In force | High confidence |
Also on record, not counted in the 9: 1 lapsed for an unpaid fee. List them
Sources and methods
Compiled from the USPTO record, grants, published applications and recorded assignments, not yet reviewed by hand.
How this record was built
Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.
Published applications
US patent applications published under this name that have not become patents. An application is published about eighteen months after its earliest filing; one that has not been published is in no public record.
2 pending · 2 abandoned · 4 no status recorded