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Through-Substrate via Structure and Method of Manufacture

US 10,950,534 In force
OverviewFamilyAssignmentsSources & methods

Term ends Aug 23, 2036 · Medium confidence

Why Medium: A parent in the chain could not be resolved.

Filed Aug 20, 2019 as application 16/545,139 · Granted Mar 16, 2021
Base term, 20 years from filing
Today
20 years from filing
2016 2036
Clock starts
Aug 23, 2016
Term ends
Aug 23, 2036
Granted
Mar 16, 2021
base term fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
None
Term adjustment
No prosecution delay on this record.
None
Terminal disclaimer
No disclaimer on this record.
1 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
53
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term is its 20-year base term, with no adjustment for prosecution delay. 1 of 3 maintenance fees is paid so far. Confidence: Medium. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Aug 23, 2016, when application 15/244,737, the earliest non-provisional in its chain, was filed (this one was filed Aug 20, 2019); a parent in its chain could not be resolved (the next row)Aug 23, 2036High confidence
Continuity chainA parent in the chain could not be resolveddated from this application's own claimMedium confidence
Patent term adjustmentNone on fileno changeHigh confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events1 of 3 maintenance fees paidIn forceHigh confidence
Computed term endThe steps above, in orderAug 23, 2036Medium confidence

This family

US 10,079,199In force
Aug 2036
Aug 2036
US 10,529,576In force
Aug 2037
Aug 2037
US 10,319,639In force
Sep 2037
Sep 2037
US 10,748,850In force
Mar 2038
Mar 2038
US 10,741,487In force
Apr 2038
Apr 2038
US 10,446,480In force
Aug 2036
Aug 2036
US 10,763,173In force
Aug 2037
Aug 2037
US 10,950,534this patent
Aug 2036
Aug 2036
8 of 53 applications in this family shown, earliest filings first. The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Aug 20, 2019
Reel 50098, frame 92
Seddon, Michael J.; Carney, Francis J.Semiconductor Components Industries, LLCAssignment of Assignor's Interest
Nov 26, 2019
Reel 51145, frame 62
Semiconductor Components Industries, LLCDeutsche Bank AG New York Branch, as Collateral AgentSecurity Interest
Dec 3, 2019
Reel 51170, frame 781
Semiconductor Components Industries, LLC; Fairchild Semiconductor CorporationDeutsche Bank AG New York Branch, as Collateral AgentCorrective Assignment to Correct the Exclusion of Fairchild Semiconductor Corporation of Conveying Party Previously Recorded on Reel 051145 Frame 0062. Assignor(S) Hereby Confirms the Security Interest.
Jun 23, 2023
Reel 64079, frame 474
Deutsche Bank AG New York Branch, as Collateral AgentSemiconductor Components Industries, LLC; Fairchild Semiconductor CorporationRelease of Security Interest in Patents Recorded at Reel 051145, Frame 0062
Jun 23, 2023
reel/frame not recorded
Deutsche Bank AG New York Branch, as Collateral AgentSemiconductor Components Industries, LLCRelease of Security Interest in Patents Recorded at Reel 051145, Frame 0062
Jun 23, 2023
reel/frame not recorded
Deutsche Bank AG New York Branch, as Collateral AgentFairchild Semiconductor CorporationRelease of Security Interest in Patents Recorded at Reel 051145, Frame 0062

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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