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Chemical-Mechanical Polishing Composition and Method for Using the Same

US 7,485,241 Term ended
OverviewFamilyAssignmentsSources & methods

Term ended Sep 11, 2023 · High confidence

Filed Sep 11, 2003 as application 10/660,379 · Granted Feb 3, 2009
Base term, 20 years from filing
Today
20 years from filing
Term ended Sep 11, 2023
2003 2026
Clock starts
Sep 11, 2003
Term ended
Sep 11, 2023
Granted
Feb 3, 2009
base term after the term ends fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
None
Term adjustment
No prosecution delay on this record.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
3
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term is its 20-year base term, with no adjustment for prosecution delay. All three maintenance fees were paid, so no fee lapse ended it. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Sep 11, 2003, when this application, 10/660,379, was filedSep 11, 2023High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustmentNone on fileno changeHigh confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidterm endedHigh confidence
Computed term endThe steps above, in orderSep 11, 2023High confidence

This family

US 7,485,241this patent
Sep 2023
Sep 2023
US 7,754,098In force
no later than Dec 2026
no later than Dec 2026
2 of 3 applications in this family shown, earliest filings first. The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Oct 2, 2003
Reel 14023, frame 498
Schroeder, David J.; Moeggenborg, Kevin J.Cabot Microelectronics CorporationAssignment of Assignor's Interest
Feb 16, 2012
Reel 27727, frame 275
Cabot Microelectronics CorporationBank of America, N.A., as Administrative AgentNotice of Security Interest in Patents
Nov 16, 2018
Reel 47587, frame 119
Bank Of America, N.a.Cabot Microelectronics CorporationRelease of Security Interest
Nov 16, 2018
Reel 47588, frame 263
Cabot Microelectronics Corporation; Qed Technologies International, Inc.; Flowchem LLC; KMG Electronic Chemicals, Inc.; Mpower Specialty Chemicals LLCJpmorgan Chase Bank, N.a.Security Agreement
Jan 13, 2021
Reel 54980, frame 681
Cabot Microelectronics CorporationCMC Materials, Inc.Change of Name
Jul 6, 2022
Reel 60592, frame 260
Jpmorgan Chase Bank, N.a.Cabot Microelectronics Corporation; Qed Technologies International, Inc.; Flowchem LLC; KMG Electronic Chemicals, Inc.; KMG-Bernuth, Inc.; Mpower Specialty Chemicals LLC; Sealweld (USA), Inc.; International Test Solutions, LLC; CMC Materials, Inc.Release of Security Interest
Jul 6, 2022
reel/frame not recorded
Jpmorgan Chase Bank, N.a.Cabot Microelectronics CorporationRelease of Security Interest
Jul 6, 2022
reel/frame not recorded
Jpmorgan Chase Bank, N.a.Qed Technologies International, Inc.Release of Security Interest
Jul 6, 2022
reel/frame not recorded
Jpmorgan Chase Bank, N.a.Flowchem LLCRelease of Security Interest
Jul 6, 2022
reel/frame not recorded
Jpmorgan Chase Bank, N.a.KMG Electronic Chemicals, Inc.Release of Security Interest
Jul 6, 2022
reel/frame not recorded
Jpmorgan Chase Bank, N.a.KMG-Bernuth, Inc.Release of Security Interest
Jul 6, 2022
reel/frame not recorded
Jpmorgan Chase Bank, N.a.Mpower Specialty Chemicals LLCRelease of Security Interest
Jul 6, 2022
reel/frame not recorded
Jpmorgan Chase Bank, N.a.Sealweld (USA), Inc.Release of Security Interest
Jul 6, 2022
reel/frame not recorded
Jpmorgan Chase Bank, N.a.International Test Solutions, LLCRelease of Security Interest
Jul 6, 2022
reel/frame not recorded
Jpmorgan Chase Bank, N.a.CMC Materials, Inc.Release of Security Interest
Jul 8, 2022
Reel 60613, frame 72
Entegris, Inc.; Entegris GP, Inc.; Poco Graphite, Inc.; CMC Materials, Inc.; International Test Solutions, LLC; Qed Technologies International, Inc.Truist Bank, as Notes Collateral AgentSecurity Interest
Jul 8, 2022
Reel 60615, frame 1
CMC Materials, Inc.; International Test Solutions, LLC; Qed Technologies International, Inc.Morgan Stanley Senior Funding, Inc., as Collateral AgentSecurity Interest
Nov 8, 2023
Reel 65517, frame 783
CMC Materials, Inc.CMC Materials LLCChange of Name

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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