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US

Solder Bump Structure for Flip Chip Semiconductor Devices and Method of Manufacture Therefore

US 7,952,206 In force
OverviewFamilyAssignmentsSources & methods

Term ends Jul 19, 2027 · High confidence

Filed Jul 21, 2006 as application 11/459,249 · Granted May 31, 2011
Base term plus 363 days of patent term adjustment (USPTO delay)
Today
20 years from filing
2006 2027
Clock starts
Jul 21, 2006
Term ends
Jul 19, 2027
Granted
May 31, 2011
base term patent term adjustment fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
363
Days of term adjustment
Read from the USPTO patent term adjustment record, not recalculated here.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
3
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term runs 363 days past its 20-year base term on prosecution delay. All three maintenance fees are recorded paid; no more fees are due. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Jul 21, 2006, when this application, 11/459,249, was filedJul 21, 2026High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustment+363 days, USPTO patent term adjustment recordJul 19, 2027High confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidIn forceHigh confidence
Computed term endThe steps above, in orderJul 19, 2027High confidence

This family

US 7,952,206this patent
Jul 2027
Jul 2027
US 8,507,317Term ended
Aug 2026
Aug 2026
Application 13/934,110Abandoned
not computed
not computed
The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Jul 21, 2006
Reel 17977, frame 242
Bachman, Mark A.; Bitting, Donald S.; Chittipeddi, Sailesh; Kang, Seung H.; Merchant, Sailesh M.Agere Systems Inc.Assignment of Assignor's Interest
May 8, 2014
Reel 32856, frame 31
LSI Corporation; Agere Systems LLCDeutsche Bank AG New York Branch, as Collateral AgentPatent Security Agreement
Apr 3, 2015
Reel 35365, frame 634
Agere Systems LLCAvago Technologies General IP (Singapore) Pte. Ltd.Assignment of Assignor's Interest
Feb 2, 2016
Reel 37684, frame 39
Deutsche Bank AG New York Branch, as Collateral AgentLSI Corporation; Agere Systems LLCTermination and Release of Security Interest in Patent Rights (Releases RF 032856-0031)
Feb 2, 2016
reel/frame not recorded
Deutsche Bank AG New York Branch, as Collateral AgentLSI CorporationTermination and Release of Security Interest in Patent Rights (Releases RF 032856-0031)
Feb 2, 2016
reel/frame not recorded
Deutsche Bank AG New York Branch, as Collateral AgentAgere Systems LLCTermination and Release of Security Interest in Patent Rights (Releases RF 032856-0031)
Feb 11, 2016
Reel 37808, frame 1
Avago Technologies General IP (Singapore) Pte. Ltd.Bank of America, N.A., as Collateral AgentPatent Security Agreement
Feb 3, 2017
Reel 41710, frame 1
Bank of America, N.A., as Collateral AgentAvago Technologies General IP (Singapore) Pte. Ltd.Termination and Release of Security Interest in Patents
Dec 17, 2017
Reel 44886, frame 766
Avago Technologies General IP (Singapore) Pte. Ltd.; Broadcom CorporationBell Semiconductor, LLCAssignment of Assignor's Interest
Feb 1, 2018
Reel 45216, frame 20
Hilco Patent Acquisition 56, LLC; Bell Semiconductor, LLC; Bell Northern Research, LLCCortland Capital Market Services LLC, as Collateral AgentSecurity Interest
Apr 15, 2022
Reel 59723, frame 382
Cortland Capital Market Services LLCHilco Patent Acquisition 56, LLC; Bell Semiconductor, LLC; Bell Northern Research, LLCRelease of Security Interest
Apr 15, 2022
reel/frame not recorded
Cortland Capital Market Services LLCHilco Patent Acquisition 56, LLCRelease of Security Interest
Apr 15, 2022
reel/frame not recorded
Cortland Capital Market Services LLCBell Semiconductor, LLCRelease of Security Interest
Apr 15, 2022
reel/frame not recorded
Cortland Capital Market Services LLCBell Northern Research, LLCRelease of Security Interest

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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