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Method of Manufacturing Non-Leaded Integrated Circuit Package System Having Etched Differential Height Lead Structures

US 8,093,694 In force
OverviewAssignmentsSources & methods

Also listed on Stats ChipPAC Pte. Lte., an earlier holder on the record. The recorded assignments below show how it moved.

Term ends Nov 27, 2026 · High confidence

Filed Nov 10, 2005 as application 11/164,088 · Granted Jan 10, 2012
Base term plus 382 days of patent term adjustment (USPTO delay)
Today
20 years from filing
2005 2026
Clock starts
Nov 10, 2005
Term ends
Nov 27, 2026
Granted
Jan 10, 2012
base term patent term adjustment fee events Updated Nov 15, 2026 · includes USPTO assignment & status data published Nov 15, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
382
Days of term adjustment
Read from the USPTO patent term adjustment record, not recalculated here.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.

This patent's term runs 382 days past its 20-year base term on prosecution delay. All three maintenance fees are recorded paid; no more fees are due. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Nov 10, 2005, when this application, 11/164,088, was filedNov 10, 2025High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustment+382 days, USPTO patent term adjustment recordNov 27, 2026High confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidIn forceHigh confidence
Computed term endThe steps above, in orderNov 27, 2026High confidence

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Nov 10, 2005
Reel 16759, frame 319
Ong, You YangStats ChipPAC Ltd.Assignment of Assignor's Interest
Oct 18, 2011
Reel 27082, frame 944
Ong, You YangStats ChipPAC Ltd.Corrective Assignment to Correct the Date Executed by the Assignor Previously Recorded on Reel 016759 Frame 0319. Assignor(S) Hereby Confirms the Executed Date by the Assignor Is 9/30/2005.
Aug 6, 2015
Reel 36288, frame 748
Stats ChipPAC, Inc.; Stats ChipPAC Ltd.Citicorp International Limited, as Common Security AgentSecurity Interest
Apr 7, 2016
Reel 38378, frame 272
Stats ChipPAC Ltd.Stats ChipPAC Pte. Lte.Change of Name
Jun 9, 2020
Reel 52879, frame 852
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.; Stats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Jun 9, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.Release of Security Interest
Jun 9, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Aug 31, 2023
Reel 65236, frame 730
Stats ChipPAC Ltd.Stats ChipPAC Pte. Ltd.Corrective Assignment to Correct the the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0272. Assignor(S) Hereby Confirms the Assignment.
Sep 3, 2025
Reel 72788, frame 917
Stats ChipPAC Pte. Ltd.Stats ChipPAC Management Pte. Ltd.Assignment of Assignor's Interest

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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