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Solder Bump Structure for Flip Chip Semiconductor Devices and Method of Manufacture Therefore

US 8,507,317 Term ended
OverviewFamilyAssignmentsSources & methods

Term ended Aug 28, 2026 · High confidence

Filed Apr 25, 2011 as application 13/093,032 · Granted Aug 13, 2013
Base term plus 38 days of patent term adjustment (USPTO delay)
Today
20 years from filing
Term ended Aug 28, 2026
2006 2026
Clock starts
Jul 21, 2006
Term ended
Aug 28, 2026
Granted
Aug 13, 2013
base term patent term adjustment after the term ends fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
38
Days of term adjustment
Read from the USPTO patent term adjustment record, not recalculated here.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
3
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term runs 38 days past its 20-year base term on prosecution delay. All three maintenance fees were paid, so no fee lapse ended it. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Jul 21, 2006, when application 11/459,249, the earliest non-provisional in its chain, was filed (this one was filed Apr 25, 2011)Jul 21, 2026High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustment+38 days, USPTO patent term adjustment recordAug 28, 2026High confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidterm endedHigh confidence
Computed term endThe steps above, in orderAug 28, 2026High confidence

This family

US 7,952,206In force
Jul 2027
Jul 2027
US 8,507,317this patent
Aug 2026
Aug 2026
Application 13/934,110Abandoned
not computed
not computed
The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Apr 25, 2011
Reel 26173, frame 374
Bachman, Mark A.; Bitting, Donald S.; Chittipeddi, Sailesh; Kang, Seung H.; Merchant, Sailesh M.Agere Systems Inc.Assignment of Assignor's Interest
Apr 22, 2013
Reel 30260, frame 394
Agere System Inc.Agere Systems LLCCertificate of Conversion
May 7, 2013
Reel 30370, frame 31
Agere System Inc.Agere Systems LLCCorrective Assignment to Correct the Assignee Address Previously Recorded on Reel 030260 Frame 0394. Assignor(S) Hereby Confirms the 1621 Barber Lane Milpitas, California 95035.
May 8, 2014
Reel 32856, frame 31
LSI Corporation; Agere Systems LLCDeutsche Bank AG New York Branch, as Collateral AgentPatent Security Agreement
Apr 3, 2015
Reel 35365, frame 634
Agere Systems LLCAvago Technologies General IP (Singapore) Pte. Ltd.Assignment of Assignor's Interest
Feb 2, 2016
Reel 37684, frame 39
Deutsche Bank AG New York Branch, as Collateral AgentLSI Corporation; Agere Systems LLCTermination and Release of Security Interest in Patent Rights (Releases RF 032856-0031)
Feb 2, 2016
reel/frame not recorded
Deutsche Bank AG New York Branch, as Collateral AgentLSI CorporationTermination and Release of Security Interest in Patent Rights (Releases RF 032856-0031)
Feb 2, 2016
reel/frame not recorded
Deutsche Bank AG New York Branch, as Collateral AgentAgere Systems LLCTermination and Release of Security Interest in Patent Rights (Releases RF 032856-0031)
Feb 11, 2016
Reel 37808, frame 1
Avago Technologies General IP (Singapore) Pte. Ltd.Bank of America, N.A., as Collateral AgentPatent Security Agreement
Feb 3, 2017
Reel 41710, frame 1
Bank of America, N.A., as Collateral AgentAvago Technologies General IP (Singapore) Pte. Ltd.Termination and Release of Security Interest in Patents
Dec 17, 2017
Reel 44886, frame 766
Avago Technologies General IP (Singapore) Pte. Ltd.; Broadcom CorporationBell Semiconductor, LLCAssignment of Assignor's Interest
Feb 1, 2018
Reel 45216, frame 20
Hilco Patent Acquisition 56, LLC; Bell Semiconductor, LLC; Bell Northern Research, LLCCortland Capital Market Services LLC, as Collateral AgentSecurity Interest
Apr 15, 2022
Reel 59723, frame 382
Cortland Capital Market Services LLCHilco Patent Acquisition 56, LLC; Bell Semiconductor, LLC; Bell Northern Research, LLCRelease of Security Interest
Apr 15, 2022
reel/frame not recorded
Cortland Capital Market Services LLCHilco Patent Acquisition 56, LLCRelease of Security Interest
Apr 15, 2022
reel/frame not recorded
Cortland Capital Market Services LLCBell Semiconductor, LLCRelease of Security Interest
Apr 15, 2022
reel/frame not recorded
Cortland Capital Market Services LLCBell Northern Research, LLCRelease of Security Interest

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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