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Methods and Systems for Controlling Temperature During Microfeature Workpiece Processing, E.G., CVD Deposition

US 8,518,184 Term ended
OverviewFamilyAssignmentsSources & methods

Term ended Dec 10, 2023 · High confidence

USPTO later recorded it as expired for non-payment on Sep 29, 2025.

No current holder resolved from the recorded chain.
Filed Jul 20, 2010 as application 12/840,153 · Granted Aug 27, 2013
Base term, 20 years from filing
Today
20 years from filing
Term ended Dec 10, 2023
2003 2026
Clock starts
Dec 10, 2003
Term ended
Dec 10, 2023
Granted
Aug 27, 2013
base term after the term ends fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
None
Term adjustment
No prosecution delay on this record.
No effect
Terminal disclaimer
Resolved from the filed document, referencing US 7,771,537, to Dec 10, 2023. The term already ends on or before that date, so the cap shortened nothing.
2 of 2
Maintenance fees paid
Two maintenance fees can end this term early, the ones due 3.5 and 7.5 years from grant; the third one's grace period runs past the term end. This counts the ones the record shows paid.
3
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term is its 20-year base term, with no adjustment for prosecution delay. A terminal disclaimer is resolved from the filed document, and it ends no earlier than this term, so it shortens nothing. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Dec 10, 2003, when application 10/733,523, the earliest non-provisional in its chain, was filed (this one was filed Jul 20, 2010)Dec 10, 2023High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustmentNone on fileno changeHigh confidence
Terminal disclaimer capDisclaimer resolved from the filed document (refs US 7,771,537)resolves to Dec 10, 2023, no earlier than this term, so no changeHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events2 of 2 maintenance fees paidterm endedHigh confidence
USPTO status recordRecorded as expired for non-payment on Sep 29, 2025, after the term endedno changeHigh confidence
Computed term endThe steps above, in orderDec 10, 2023High confidence

This family

US 7,258,892Term ended
Oct 2024
Oct 2024
US 7,771,537In force
Nov 2026
Nov 2026
US 8,518,184this patent
Dec 2023
Dec 2023
The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
May 12, 2016
Reel 38669, frame 1
Micron Technology, Inc.U.S. Bank National Association, as Collateral AgentSecurity Interest
Jun 2, 2016
Reel 38954, frame 1
Micron Technology, Inc.Morgan Stanley Senior Funding, Inc., as Collateral AgentPatent Security Agreement
Jun 8, 2017
Reel 43079, frame 1
Micron Technology, Inc.U.S. Bank National Association, as Collateral AgentCorrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest.
Jul 13, 2018
Reel 47540, frame 1
Micron Technology, Inc.; Micron Semiconductor Products, Inc.JPMorgan Chase Bank, N.A., as Collateral AgentSecurity Interest
Aug 23, 2018
Reel 47243, frame 1
U.S. Bank National Association, as Collateral AgentMicron Technology, Inc.Release of Security Interest
Oct 9, 2019
Reel 50937, frame 1
Morgan Stanley Senior Funding, Inc., as Collateral AgentMicron Technology, Inc.Release of Security Interest
Nov 12, 2019
Reel 51028, frame 1
JPMorgan Chase Bank, N.A., as Collateral AgentMicron Technology, Inc.; Micron Semiconductor Products, Inc.Release of Security Interest
Nov 12, 2019
reel/frame not recorded
JPMorgan Chase Bank, N.A., as Collateral AgentMicron Technology, Inc.Release of Security Interest
Nov 12, 2019
reel/frame not recorded
JPMorgan Chase Bank, N.A., as Collateral AgentMicron Semiconductor Products, Inc.Release of Security Interest

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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