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Semiconductor Device and Method of Forming Stud Bumps Over Embedded Die

US 8,525,337 Term ended
OverviewFamilyAssignmentsSources & methods

Term ended Nov 14, 2026 · Medium confidence

Why Medium: A parent in the chain could not be resolved.

Filed Apr 6, 2012 as application 13/441,691 · Granted Sep 3, 2013
Base term plus 4 days of patent term adjustment (USPTO delay)
Today
20 years from filing
Term ended Nov 14, 2026
2006 2026
Clock starts
Nov 10, 2006
Term ended
Nov 14, 2026
Granted
Sep 3, 2013
base term after the term ends fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
4
Days of term adjustment
Read from the USPTO patent term adjustment record, not recalculated here.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
9
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term runs 4 days past its 20-year base term on prosecution delay. All three maintenance fees were paid, so no fee lapse ended it. Confidence: Medium. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Nov 10, 2006, when application 11/595,638, the earliest non-provisional in its chain, was filed (this one was filed Apr 6, 2012); a parent in its chain could not be resolved (the next row)Nov 10, 2026High confidence
Continuity chainA parent in the chain could not be resolveddated from this application's own claimMedium confidence
Patent term adjustment+4 days, USPTO patent term adjustment recordNov 14, 2026High confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidterm endedHigh confidence
Computed term endThe steps above, in orderNov 14, 2026Medium confidence

This family

US 8,174,119In force
Apr 2029
Apr 2029
US 8,133,762In force
Sep 2029
Sep 2029
US 8,193,034Term ended
Nov 2026
Nov 2026
US 8,742,579In force
Aug 2029
Aug 2029
US 8,525,337this patent
Nov 2026
Nov 2026
US 9,263,361Term ended
Nov 2026
Nov 2026
US 9,385,074Term ended
no later than Nov 2026
no later than Nov 2026
US 9,640,504In force
May 2029
May 2029
8 of 9 applications in this family shown, earliest filings first. The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Aug 6, 2015
Reel 36288, frame 748
Stats ChipPAC, Inc.; Stats ChipPAC Ltd.Citicorp International Limited, as Common Security AgentSecurity Interest
Apr 7, 2016
Reel 38378, frame 360
Stats ChipPAC Ltd.Stats ChipPAC Pte. Lte.Change of Name
Apr 11, 2016
Reel 38401, frame 532
Stats ChipPAC Ltd.Stats ChipPAC Pte. Lte.Change of Name
Jun 5, 2020
Reel 52850, frame 237
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.; Stats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Jun 5, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC, Inc.Release of Security Interest
Jun 5, 2020
reel/frame not recorded
Citicorp International Limited, as Common Security AgentStats ChipPAC Pte. Ltd. Formerly Known as Stats ChipPAC Ltd.Release of Security Interest
Sep 1, 2023
Reel 64803, frame 109
Stats ChipPAC Ltd.Stats ChipPAC Pte. Ltd.Corrective Assignment to Correct the Correct the Spelling of Assignee's Name from "Stats Chippac Pte. LTE," to "Stats Chippac Pte. Ltd." Previously Recorded at Reel: 038401 Frame: 0532. Assignor(S) Hereby Confirms the Assignment.

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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