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Methods for Reducing the Metal Content in the Device Layer of Soi Structures and Soi Structures Produced by Such Methods

US 8,796,116 In force
OverviewFamilyAssignmentsSources & methods

Term ends Jan 20, 2032 · High confidence

Filed Jan 20, 2012 as application 13/354,788 · Granted Aug 5, 2014
Base term, 20 years from filing
Today
20 years from filing
2012 2032
Clock starts
Jan 20, 2012
Term ends
Jan 20, 2032
Granted
Aug 5, 2014
base term fee events Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know
None
Term adjustment
No prosecution delay on this record.
None
Terminal disclaimer
No disclaimer on this record.
3 of 3
Maintenance fees paid
Three maintenance fees fall due, at 3.5, 7.5 and 11.5 years from grant. This counts the ones the record shows paid.
4
Family applications on record here
Applications sharing this one's continuity chain whose file history this site holds. The family may have others.

This patent's term is its 20-year base term, with no adjustment for prosecution delay. All three maintenance fees are recorded paid; no more fees are due. Confidence: High. from the record

How we calculated this date

One row per rule, each showing its own input and what it did to the date. A step we could not verify says so instead of resolving itself.
StepInputDate after this stepConfidence
Base term, 20 years from filingClock starts Jan 20, 2012, when this application, 13/354,788, was filedJan 20, 2032High confidence
Continuity chainEvery parent in the chain resolvedno changeHigh confidence
Patent term adjustmentNone on fileno changeHigh confidence
Terminal disclaimer capNone on recordno cap appliedHigh confidence
Patent term extensionNone on fileno changeHigh confidence
Fee events3 of 3 maintenance fees paidIn forceHigh confidence
Computed term endThe steps above, in orderJan 20, 2032High confidence

This family

US 8,796,116this patent
Jan 2032
Jan 2032
Application PCT/US2012/022970PCT application
no patent term
no patent term
Application 13/762,967Abandoned
not computed
not computed
Application 13/762,974Abandoned
not computed
not computed
The applications whose file history this site holds. The family may have others.

Assignments

Assignment documents as recorded at the USPTO, oldest first, with the reel and frame each was recorded at. A recorded assignment is a filed document, not a statement of current ownership, and the absence of a later one is not evidence that the last one still stands.
RecordedAssignorAssigneeConveyance
Apr 2, 2012
Reel 27969, frame 286
Grabbe, Alexis; Flannery, LarryMemc Electronic Materials, Inc.Assignment of Assignor's Interest
Oct 1, 2012
Reel 29057, frame 810
NVT, LLC; Sun Edison LLC; Solaicx, Inc.; Memc Electronic Materials, Inc.Goldman Sachs Bank USASecurity Agreement
Dec 26, 2013
Reel 31870, frame 92
Goldman Sachs Bank USANVT, LLC; Sun Edison LLC; Solaicx; SunEdison, Inc. (F/K/A Memc Electronic Materials, Inc.)Release of Security Interest
Dec 26, 2013
reel/frame not recorded
Goldman Sachs Bank USANVT, LLCRelease of Security Interest
Dec 26, 2013
reel/frame not recorded
Goldman Sachs Bank USASun Edison LLCRelease of Security Interest
Dec 26, 2013
reel/frame not recorded
Goldman Sachs Bank USASolaicxRelease of Security Interest
Dec 26, 2013
reel/frame not recorded
Goldman Sachs Bank USASunEdison, Inc. (F/K/A Memc Electronic Materials, Inc.)Release of Security Interest
Jan 30, 2014
Reel 32177, frame 359
SunEdison, Inc.; Solaicx; Sun Edison, LLC; NVT, LLCDeutsche Bank AG New York BranchSecurity Agreement
Mar 3, 2014
Reel 32382, frame 724
Deutsche Bank AG New York BranchNVT, LLC; Sun Edison LLC; Solaicx; SunEdison, Inc.Release of Security Interest
Mar 3, 2014
reel/frame not recorded
Deutsche Bank AG New York BranchNVT, LLCRelease of Security Interest
Mar 3, 2014
reel/frame not recorded
Deutsche Bank AG New York BranchSun Edison LLCRelease of Security Interest
Mar 3, 2014
reel/frame not recorded
Deutsche Bank AG New York BranchSolaicxRelease of Security Interest
Mar 3, 2014
reel/frame not recorded
Deutsche Bank AG New York BranchSunEdison, Inc.Release of Security Interest
May 27, 2014
Reel 33023, frame 430
Memc Electronic Materials, Inc.SunEdison Semiconductor Limited (UEN201334164H)Assignment of Assignor's Interest
Jun 6, 2014
Reel 33099, frame 1
SunEdison Semiconductor LimitedSunEdison Semiconductor Technology Pte. Ltd.Notice of License Agreement
Jun 7, 2018
Reel 46327, frame 1
SunEdison Semiconductor Limited; Memc Japan Limited; Memc Electronic Materials S.P.A.GlobalWafers Co., Ltd.Assignment of Assignor's Interest

Sources

Google Patents · The patent document at USPTO · Assignment records at USPTO

USPTO account required: This application in Patent Center · USPTO's maintenance fee lookup

Maintenance fee events come from USPTO's own fee records. Its fee lookup asks for the patent number and the application number.

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