23 patents currently held

Held is read from USPTO's recorded assignments; a transfer never recorded there does not appear.

The next term ends in Mar 2039. from the record

Free plan: 3 watched companies. Pro: unlimited.

Alerts on its grants, lapses and transfers.

Ending by 2030

Mar 2039

Next term end

Patent families

When these terms end

5 yrs10 yrs20 yrs

Held patents by the year their term ends

20262027202820292030203120322033203420352036203720382039 2040 2041 2042 2043 20442045

notable patents all others Updated Nov 14, 2026 · includes USPTO assignment & status data published Nov 14, 2026 and grant & fee data published Nov 10, 2026 (weekly) · how we know

Notable: the highest-ranked patents in this portfolio by citations and family size.

Notable patents

Ranked by citations and family size, against patents of the same kind granted the same year. How we rank

Notable

Packaging Substrate with Core Layer and Cavity Structure and Semiconductor Device Comprising the Same US 11,652,039

The most cited patent in this portfolio, cited by 7 later US patents, top 10% of utility patents granted in 2023 in our data. Protection runs to 2040.

Ends Mar 2040 · High confidence Also notable

Packaging Substrate Having Electric Power Transmitting Elements on Non-Circular Core via of Core Vias and Semiconductor Device Comprising the Same US 11,469,167

Granted 2022. Computed term ends 2040.

Ends Apr 2040 · High confidence Also notable

Semiconductor Device Having a Glass Substrate Core Layer US 10,903,157

The earliest of the three still in force, granted 2021 and renewed since. Its term ends first, in 2039.

Ends Mar 2039 · High confidence

Fee deadlines

Maintenance fees fall due 3.5, 7.5 and 11.5 years after grant. A missed fee ends a patent at the end of the six month grace period that follows, not on the due date.

1 fee due Feb 15, 2027
The maintenance fee for Packaging Substrate Having Electric Power Transmitting Elements on Non-Circular Core via of Core Vias and Semiconductor Device Comprising the Same (US 11,728,259) comes due Feb 15, 2027. Unpaid by Aug 16, 2027, it lapses early.
1 fee due Oct 23, 2027
The maintenance fee for Packaging Substrate, and Semiconductor Device Comprising Same (US 11,967,542) comes due Oct 23, 2027. Unpaid by Apr 24, 2028, it lapses early.

Which patents, and when each one lapses · Pro

Recent changes

6 of the patents on this record were granted since Aug 16, 2026

What they patent

The 5 largest of its 20 families, grouped by real patent family and labeled by the earliest filing in each. No technology classification is inferred from titles.

Packaging Substrate Having Electric Power Transmitting Elements on Non-Circular Core via of Core Vias and Semiconductor Device Comprising the Same	3 in force	to Apr 2040
Packaging Substrate with Core Layer and Cavity Structure and Semiconductor Device Comprising the Same	2 in force	to Mar 2041
Packaging Substrate Having Cavity Portions and Method of Manufacturing the Same	1 in force	to Aug 2044
Substrate Comprising a Lid Structure, Package Substrate Comprising the Same and Semiconductor Device	1 in force	to Feb 2044
Via Connection Structure Comprising Multiple Vias and Substrate Comprising the Same	1 in force	to Nov 2043

Patents held now

Soonest term end first.

Patent	Title	Status	Expires	Confidence
US 10,903,157	Semiconductor Device Having a Glass Substrate Core Layer In force Term ends Mar 8, 2039 · High confidence	In force	Term ends Mar 8, 2039	High confidence
US 12,288,742	Packaging Substrate and Semiconductor Apparatus Comprising Same In force Term ends Mar 6, 2040 · High confidence	In force	Term ends Mar 6, 2040	High confidence
US 11,652,039	Packaging Substrate with Core Layer and Cavity Structure and Semiconductor Device Comprising the Same In force Term ends Mar 12, 2040 · High confidence	In force	Term ends Mar 12, 2040	High confidence
US 11,437,308	Packaging Glass Substrate for Semiconductor, a Packaging Substrate for Semiconductor, and a Semiconductor Apparatus In force Term ends Mar 27, 2040 · High confidence	In force	Term ends Mar 27, 2040	High confidence
US 11,469,167	Packaging Substrate Having Electric Power Transmitting Elements on Non-Circular Core via of Core Vias and Semiconductor Device Comprising the Same In force Term ends Apr 10, 2040 · High confidence	In force	Term ends Apr 10, 2040	High confidence
US 11,728,259	Packaging Substrate Having Electric Power Transmitting Elements on Non-Circular Core via of Core Vias and Semiconductor Device Comprising the Same In force Term ends Apr 10, 2040 · High confidence	In force	Term ends Apr 10, 2040	High confidence
US 12,027,454	Packaging Substrate Having Electric Power Transmitting Elements on Non-Circular Core via of Core Vias and Semiconductor Device Comprising the Same In force Term ends Apr 10, 2040 · Medium confidence	In force	Term ends Apr 10, 2040	Medium confidence
US 12,456,672	Packaging Substrate Having Element Group in Cavity Unit and Semiconductor Device Comprising the Same In force Term ends Mar 17, 2041 · High confidence	In force	Term ends Mar 17, 2041	High confidence
US 11,967,542	Packaging Substrate, and Semiconductor Device Comprising Same In force Term ends May 9, 2041 · High confidence	In force	Term ends May 9, 2041	High confidence
US 11,981,501	Loading Cassette for Substrate Including Glass and Substrate Loading Method to Which Same Is Applied In force Term ends May 29, 2041 · High confidence	In force	Term ends May 29, 2041	High confidence

10 of 23 patents shown.

Pro members see all 23.

Pro members: see all 23 patents

Also on record, not counted in the 23: 71 applications pending · 2 applications abandoned. List them

Sources and methods

Compiled from USPTO application file histories, grants and recorded assignments, with the company's own names reviewed by hand. How this record was built

Portfolio grouped automatically from ownership conveyances to the names matched to this company, usually every name that begins with its own, so it counts patents an affiliate holds; each list row names the holder of record. Security interests are excluded and ambiguous records are not reviewed by hand.

Computed patent terms end on the dates shown. Related patents and pending applications may cover overlapping subject matter.

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