Absolics Inc.
Records under this name other than the patents Absolics Inc. holds now: patents now held by others, patents whose terms have ended, and its applications, pending or abandoned. None of them is counted in the 23 patents it holds.
| Patent | Title | Status | Expires | Confidence |
|---|---|---|---|---|
| 17/433,347 | Packaging Substrate and Semiconductor Apparatus Comprising Same Abandoned Abandoned Apr 1, 2024 | Abandoned | Abandoned Apr 1, 2024 | |
| 18/011,400 | Device Packaging Substrate, Manufacturing Method for the Same, and Device Package Comprising the Same Pending Term is not computable until grant, so no date is shown and no estimate is implied. | Pending | Term is not computable until grant, so no date is shown and no estimate is implied. | |
| 18/013,360 | Cleaned Packaging Substrate and Cleaned Packaging Substrate Manufacturing Method Abandoned Abandoned Jun 11, 2025 | Abandoned | Abandoned Jun 11, 2025 | |
| 18/366,679 | Semiconductor Packaging Substrate with Core-Substrate and Protected Area Pending Term is not computable until grant, so no date is shown and no estimate is implied. | Pending | Term is not computable until grant, so no date is shown and no estimate is implied. | |
| 18/458,159 | Method of Manufacturing Packaging Substrate and Packaging Substrate Manufactured Thereby Pending Term is not computable until grant, so no date is shown and no estimate is implied. | Pending | Term is not computable until grant, so no date is shown and no estimate is implied. | |
| 18/499,241 | Packaging Substrate Having Recessed Cavity and Peripheral Heat Dissipation Structure Pending Term is not computable until grant, so no date is shown and no estimate is implied. | Pending | Term is not computable until grant, so no date is shown and no estimate is implied. | |
| 18/500,987 | Packaging Substrate and Semiconductor Package Comprising the Same Pending Term is not computable until grant, so no date is shown and no estimate is implied. | Pending | Term is not computable until grant, so no date is shown and no estimate is implied. | |
| 18/508,238 | Substrate and semiconductor module Pending Term is not computable until grant, so no date is shown and no estimate is implied. | Pending | Term is not computable until grant, so no date is shown and no estimate is implied. | |
| 18/523,906 | Semiconductor Packaging Substrate, Semiconductor Packages, and Method for Manufacturing the Semiconductor Packaging Substrate Pending Term is not computable until grant, so no date is shown and no estimate is implied. | Pending | Term is not computable until grant, so no date is shown and no estimate is implied. | |
| 18/575,061 | Substrate and Package Substrate Comprising the Same Pending Term is not computable until grant, so no date is shown and no estimate is implied. | Pending | Term is not computable until grant, so no date is shown and no estimate is implied. |